Moisture Protected Illuminated Light Strip Encapsulation
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Solution Overview
Problem
Existing field-installable light strip devices are not effectively protected from moisture and water, leading to damage and corrosion of LEDs and printed circuit boards, as reliance on joint seals is not always efficient and durable.
Innovation Solution
A field-installable illumination device with a frame, a printed circuit board secured to the frame, and an encapsulating material that surrounds the circuit board to prevent exposure to moisture, using a translucent lens cover and endcaps to create a fluid-tight seal and protect the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If joint seals are used to protect LEDs and circuit boards from moisture, then the device can be installed in the field, but the protection is not always effective and the seals wear down over time
Solution Approach 1:
The patent applies an encapsulating material that forms a continuous protective shell around the printed circuit board and LEDs. This encapsulation acts as a flexible barrier that prevents moisture ingress while maintaining the structural integrity of the light strip, replacing the inadequate joint seals with a comprehensive protective envelope.
Solution Approach 2:
The patent implements a nested protection structure where the printed circuit board is first secured to the frame, then the encapsulating material is applied over the board and LEDs, creating multiple layers of protection. The frame provides structural support, while the encapsulating material provides environmental protection, with each layer nested within or around the other.
2Object-affected harmful factors
If joint seals are used to prevent water and moisture entry, then some protection is provided, but the solution is not cost efficient and requires frequent replacement
Solution Approach 1:
The patent combines the protective function with the structural design by integrating the encapsulating material application into the manufacturing process itself. Rather than adding separate protective components like joint seals, the encapsulation is applied as a unified layer during assembly, reducing part count and manufacturing complexity while improving protection effectiveness.
3Adaptability or versatility
If LEDs and circuit boards are exposed to outdoor environments, then the light strip can be used for various applications, but water and moisture cause damage and corrosion
Solution Approach 1:
The encapsulating material forms a continuous protective film over the entire printed circuit board and LED assembly, creating a barrier that allows the light strip to be deployed in outdoor and harsh environments without fear of moisture-induced corrosion or damage, thereby expanding application versatility.
Data Source
AI summary
The present invention provides an illumination device having a frame with an upper surface and a pair of opposing walls extending upward from lateral sides of the upper surface, a printed circuit board with a plurality of light emitting diodes that is secured to the upper surface of the device's frame, and an encapsulating material that substantially surrounds the printed circuit board to prevent the printed circuit board from being exposed to moisture and other elements.