Light-Emitting Substrate Wettability Layout for Fast LED Chip Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The difficulty of transferring LED chips in mini-LED and micro-LED display panels increases with higher resolution due to the larger number of chips required, complicating the production process.
Innovation Solution
A light-emitting substrate with distinct wettability characteristics on opposite sides of each light-emitting unit, where the side with the electrode unit has higher wettability, allowing the units to align and fixate with the substrate through a controlled liquid evaporation process, optimizing the transfer method and accelerating the transfer speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the resolution of the display panel is increased, then the display quality is improved, but the number of LED chips increases and the transfer difficulty increases
Solution Approach 1:
The patent replaces the traditional mechanical transfer method with a liquid suspension-based transfer method. LED chips are suspended in liquid and guided to electrode regions through liquid flow control, eliminating the need for complex mechanical transfer equipment and reducing transfer difficulty while maintaining high resolution display quality
Solution Approach 2:
The patent utilizes liquid suspension and liquid flow to transport and position LED chips. By controlling the liquid flow dynamics, chips are guided to specific electrode regions, providing a hydraulic-based solution that simplifies the transfer process for high-resolution displays with large numbers of chips
2Productivity
If the transfer speed is increased, then the production efficiency is improved, but the alignment precision may be compromised
Solution Approach 1:
The liquid suspension system allows for rapid chip transport while maintaining precise positioning through liquid flow control. The viscous drag and surface tension forces in the liquid provide natural damping that prevents overshooting, enabling fast transfer speeds without compromising alignment precision
Solution Approach 2:
The patent changes the physical state of the transfer medium to liquid suspension, which provides both rapid transport capability and precise positioning control. By adjusting liquid properties such as viscosity and flow rate, the system achieves optimal balance between transfer speed and alignment precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The optimized transfer method enhances the production efficiency by facilitating faster and more precise alignment of LED chips onto the substrate, improving overall manufacturing speed and efficiency.
Implementation Method 1
a wettability of the first side is greater than a wettability of the second side
Implementation Method 2
heating the first substrate to remove the first liquid
Data Source
AI summary
A light-emitting substrate and a manufacturing method thereof are provided. The light-emitting substrate includes a first substrate and a plurality of light-emitting units. The first substrate includes a plurality sets of electrode opening-holes. Each light-emitting unit includes a first side and a second side disposed opposite to each other. Each light-emitting unit includes an electrode unit disposed on the first side, and the electrode unit is positioned in the electrode opening-holes. A wettability of the first side is greater than a wettability of the second side.


