Light-Emitting Substrate Voltage Layout Against Cu Corrosion

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The electrochemical corrosion between the conductive layers in light-emitting substrates, particularly at overlapping regions with different voltage potentials, leads to reduced light-emitting stability and potential short circuits, which affects the performance and longevity of the substrate.

Innovation Solution

The light-emitting substrate design includes a specific arrangement of conductive layers and insulation layers to minimize electrochemical corrosion by ensuring that voltage differences across overlapping regions are managed to reduce exposure to water and oxygen, using Cu for low resistance and insulation to protect against corrosion, and employing a structured connection of light-emitting elements to stabilize the electrical connections.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conductive layers are arranged with overlapping regions to connect light-emitting elements, then electrical connection is achieved, but electrochemical corrosion occurs due to voltage differences

Engineering Contradiction:
Improvelight-emitting stabilityVSAvoidelectrochemical corrosion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The patent applies equipotentiality by connecting multiple light-emitting elements to the same common voltage line, ensuring they operate at the same potential. This eliminates voltage differences between overlapping conductive layers, preventing electrochemical corrosion while maintaining electrical connection stability

Inventive Principle:
Principle #12Equipotentiality

Solution Approach 2:

The patent introduces a common voltage line as an intermediary conductive layer between driving voltage lines and light-emitting elements. This intermediary structure manages voltage distribution and prevents direct contact between conductive layers at different potentials, thereby eliminating corrosion conditions

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If Cu material is used for conductive layers to reduce resistance, then electrical conductivity is improved, but susceptibility to electrochemical corrosion increases

Engineering Contradiction:
Improveelectrical conductivityVSAvoidelectrochemical corrosion
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

By maintaining equipotential conditions through the common voltage line architecture, the patent eliminates the voltage differential that would otherwise cause electrochemical corrosion of Cu conductive layers, allowing Cu to be used for its excellent conductivity without corrosion penalties

Inventive Principle:
Principle #12Equipotentiality

Solution Approach 2:

The patent converts the potential harm of Cu corrosion into a benefit by designing the circuit architecture to eliminate corrosion conditions entirely, allowing the use of Cu's superior electrical conductivity properties without suffering from its corrosion vulnerability

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

3Power

If multiple element groups are connected to different driving voltage lines, then voltage distribution is optimized, but exposure to water and oxygen increases

Engineering Contradiction:
Improvevoltage distributionVSAvoidexposure to water and oxygen
Core Design Contradiction:
PowerVSObject-affected harmful factors

Solution Approach 1:

The patent transitions from a planar arrangement to a multi-layer vertical structure, organizing conductive layers and light-emitting elements in three-dimensional space. This dimensional change allows optimized voltage distribution across layers while reducing the lateral exposure area to water and oxygen

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces the impact of electrochemical corrosion, enhancing the light-emitting stability and longevity of the substrate by protecting the conductive layers and maintaining stable electrical connections, thereby improving the overall performance and reliability of the substrate.

Implementation Method 1

a plurality of light-emitting components arranged on one side, away from the substrate, of the first conductive layer, where each of the plurality of light-emitting components includes a plurality of light-emitting elements

Methodology Applied
Scientific EffectLight emission: Light Emitting Diode

Data Source

PatentUS12489091B2Light-emitting substrate and display device
Publication Date: 2025.12.02 BEIJING BOE TECH DEV CO LTD
  • US12489091B2 patent drawing
  • US12489091B2 patent drawing
  • US12489091B2 patent drawing

AI summary

Disclosed are a light-emitting substrate and a display device. The light-emitting substrate includes a substrate; a first conductive layer arranged on the substrate, the first conductive layer including a plurality of driving voltage lines arranged at intervals; and a plurality of light-emitting components arranged on one side, away from the substrate, of the first conductive layer, each of the light-emitting components including a plurality of light-emitting elements, the plurality of light-emitting elements being divided into a plurality of element groups, and in the same light-emitting component, at least two element groups being electrically connected to different driving voltage lines.