Light Emitting Substrate Structure to Prevent Dicing Tape Peeling

The patent applies preliminary action by forming a protrusion on the substrate surface before the dicing process. This protrusion serves as a pre-prepared structural feature that will interact with the dicing tape during cutting, preventing the adhesive from extending to the chip edges. The protrusion is created in advance through photolithography and etching processes, ensuring the substrate is prepared with protective features before the dicing operation begins.

The protrusion acts as an intermediary element between the dicing tape and the chip edge. During the dicing process, the dicing tape contacts the protrusion first, and the protrusion prevents the adhesive material from reaching the chip edge. This intermediary structure transfers the mechanical interaction from direct tape-to-chip contact to tape-to-protrusion contact, thereby protecting the chip integrity while maintaining the dicing function.

The protrusion is formed in advance before dicing using standard semiconductor fabrication processes (photolithography and etching). This preliminary structural preparation ensures that when the dicing tape is applied and extended, the adhesive material will contact the protrusion rather than the chip edge, preventing contamination while maintaining manufacturing simplicity.

The patent converts the potentially harmful extension of adhesive material into a beneficial effect by directing it toward the protrusion instead of the chip edge. The adhesive material still extends during dicing as before, but this extension is redirected to contact only the protrusion, which is designed to receive such contact without compromising chip quality. Thus, the harmful adhesive extension is transformed into a controlled interaction that protects rather than damages the chip.