Light-Emitting Substrate Wiring Layout With Fewer Masks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The manufacturing process of light-emitting substrates using mini/micro LEDs is costly and difficult due to the need for multiple film layers of metal wiring patterns, which require different masks for patterning, leading to increased mask usage and design complexity.
Innovation Solution
A manufacturing method that reduces the number of masks by using a single mask for forming conductive patterns and insulating layers, allowing for electrical connections through via holes, thereby optimizing the process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple different masks are used for patterning metal wiring patterns in different film layers, then electrical connectivity between layers is achieved, but mask quantity and design complexity increase
Solution Approach 1:
The first mask is designed to serve multiple functions: it patterns both the first metal wiring pattern in the first film layer and the second metal wiring pattern in the second film layer. This multi-functional mask reduces the total number of masks needed while maintaining proper electrical connectivity between layers through the via holes formed in the insulating layer.
Solution Approach 2:
The patent combines the patterning function for two different metal layers into a single mask design. By merging the pattern formation steps for the first and second metal wiring patterns into one masking step, the process complexity is reduced while achieving the necessary electrical connections between layers.
2Manufacturing precision
If multiple different masks are used for patterning conductive patterns in different film layers, then precise pattern formation is achieved, but manufacturing cost increases
Solution Approach 1:
The first mask is designed as a universal patterning tool that creates precise patterns for both the first metal wiring pattern and the second metal wiring pattern simultaneously. This multi-functional approach maintains manufacturing precision while reducing the number of masking steps and associated costs.
Solution Approach 2:
By merging the pattern formation processes for two separate metal layers into a single masking operation, the patent reduces manufacturing steps, time, and material consumption, thereby lowering overall manufacturing cost while preserving pattern precision through careful mask design.
3Reliability
If multiple film layers of metal wiring patterns are formed, then electrical connectivity between layers is established, but the number of masks required increases
Solution Approach 1:
The first mask performs the dual function of patterning both the first metal wiring pattern in the first film layer and the second metal wiring pattern in the second film layer. This eliminates the need for separate masks for each layer, reducing mask quantity while ensuring proper electrical connectivity through the insulating layer via holes.
Solution Approach 2:
The patent merges the masking requirements for two different metal layers into a single mask design, reducing the total number of masks from two or more to just one (the first mask), while maintaining all necessary electrical connections between layers.
Data Source
AI summary
A light-emitting substrate and a manufacturing method thereof, and a display device are provided. The manufacturing method includes: providing a base substrate; forming a first conductive pattern on the base substrate using a first mask; forming a first insulating layer on the first conductive pattern using a second mask, to form a first via hole and a second via hole; forming a second conductive pattern on the first insulating layer using the first mask, the second conductive pattern being electrically connected to the first conductive pattern through the first via hole and the second via hole; forming a second insulating layer on the second conductive pattern using the second mask, to form a third via hole; and forming a third conductive pattern on the second insulating layer using a third mask, the third conductive pattern being electrically connected to the second conductive pattern through the third via hole.