Light-Emitting Substrate Layout for Lower-Resistance HDR Backlights
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Solution Overview
Problem
Existing display technologies using mini-LEDs and micro-LEDs face challenges in optimizing the layout and reducing the resistance of signal lines in backlight modules, which affects the efficiency and brightness of high dynamic range (HDR) displays.
Innovation Solution
A light-emitting substrate design with specific arrangements of signal lines, element groups, and control chips, including bridge portions and connection patterns to reduce resistance and improve space utilization, allowing for a more efficient layout and reduced thickness of signal lines.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If signal lines are arranged in conventional layouts for mini-LED/micro-LED backlight modules, then the backlight module can be assembled, but the resistance of signal lines increases and space utilization decreases
Solution Approach 1:
The patent transitions from conventional two-dimensional signal line arrangement to a three-dimensional stacked architecture where control chips are positioned above the substrate surface. This vertical dimension allows signal lines to be routed more efficiently beneath the LED elements, reducing resistance and improving space utilization without increasing planar complexity.
Solution Approach 2:
The backlight module is segmented into distinct functional layers: substrate layer, LED element layer, and control chip layer. This segmentation allows each component to be optimized independently, with signal lines confined to specific regions and control chips positioned to minimize interconnection resistance.
2Reliability
If control chips are positioned adjacent to element groups, then electrical connection is achieved, but space utilization and layout efficiency are reduced
Solution Approach 1:
Control chips are relocated from the planar substrate surface to a vertical position above the substrate, utilizing the third dimension. This allows the substrate area to be fully utilized for LED element arrangement while control chips occupy vertical space, eliminating the trade-off between connection reliability and area utilization.
Solution Approach 2:
The patent employs multiple control chips that can be positioned at optimized locations above the substrate, each serving specific regions of LED elements. This distributed control architecture improves electrical connection reliability while maintaining efficient substrate area utilization through vertical stacking.
Data Source
AI summary
A light-emitting substrate includes a substrate, a plurality of signal line groups disposed on the substrate and arranged in a first direction, a plurality of columns of element groups arranged in the first direction, and a plurality of columns of control chips arranged in the first direction. each column of element groups includes a plurality of element groups arranged at intervals in a second direction, a column of element groups is electrically connected to a part of signal lines of a signal line group. Each column of control chips includes a plurality of control chips arranged at intervals in the second direction. A column of control chips is arranged on a side of the column of element groups in the first direction, and is electrically connected to the column of element groups and a part of signal lines of the signal line group.