Light-Emitting Substrate Signal Layout for IR Drop and Heat Dissipation

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Solution Overview

Problem

Existing Micro/Mini LED display technologies face challenges with IR drop and heat dissipation, particularly in large-size display devices, due to the generation of heat during the display process which leads to red-shift of light-emitting wavelengths and non-uniform display effects.

Innovation Solution

A light-emitting substrate design featuring a base substrate with a first signal line and an insulation layer, where the first signal line is electrically connected to an electrode terminal via a through hole, and at least one light-emitting element is bound to the electrode terminals. The first signal line is designed with a larger width and thickness to enhance heat dissipation and reduce IR drop.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional signal line design is used in Micro/Mini LED display, then device complexity is reduced, but heat dissipation performance deteriorates and IR drop increases

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidsignal line structure complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The signal line is segmented into multiple parts: a first signal line layer directly connected to the light-emitting element, and a second signal line layer connected to the driving circuit. This segmentation allows each layer to be optimized for its specific function - the first layer for heat dissipation and the second for signal transmission - thereby improving heat dissipation performance while maintaining manageable device complexity through functional division.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent introduces a vertical dimension by stacking signal lines in multiple layers rather than using a single planar layer. The first signal line is positioned closer to the light-emitting element while the second signal line is positioned farther away, creating a three-dimensional signal line structure. This dimensional change enables improved heat dissipation pathways without significantly increasing overall device complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Manufacturing precision

If conventional signal line design is used in Micro/Mini LED display, then manufacturing process simplicity is maintained, but display uniformity deteriorates due to IR drop

Engineering Contradiction:
Improvedisplay uniformityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

By segmenting the signal line into two distinct layers with different functional optimizations, the patent achieves better display uniformity. The first signal line layer is designed with parameters optimized for reducing IR drop near the light-emitting element, while the second layer handles signal transmission to the driving circuit, thereby improving manufacturing precision without excessive complexity increase.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by giving different characteristics to different parts of the signal line structure. The first signal line layer has specific width, thickness, and material properties optimized for the region near the light-emitting element to minimize IR drop, while the second layer has properties optimized for signal transmission. This localized optimization improves display uniformity while keeping the overall manufacturing process manageable.

Inventive Principle:
Principle #3Local quality

3Temperature

If signal line width and thickness are increased to reduce IR drop, then power consumption increases, but if they are kept small, then heat dissipation performance deteriorates

Engineering Contradiction:
Improveheat dissipation performanceVSAvoidpower consumption
Core Design Contradiction:
TemperatureVSUse of energy by moving object

Solution Approach 1:

The segmented signal line structure allows the first layer to have larger dimensions optimized for heat dissipation near the light-emitting element, while the second layer can have smaller dimensions optimized for low-power signal transmission to the driving circuit. This segmentation enables heat dissipation optimization without proportionally increasing power consumption across the entire signal line.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent applies local quality by optimizing signal line dimensions at different locations. The first signal line layer near the light-emitting element has larger width and thickness for effective heat dissipation, while the second signal line layer farther away has smaller dimensions to minimize resistance and power consumption. This localized optimization resolves the contradiction between heat dissipation and power consumption.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed light-emitting substrate effectively reduces IR drop and power consumption, improves heat dissipation, and prevents chromatic aberration in large-size display devices, leading to enhanced display uniformity and performance.

Implementation Method 1

an electrode layer located at one side of the insulation layer away from the base substrate and including a first electrode terminal, a second electrode terminal and a second signal line, the first electrode terminal being electrically connected to the first signal line via a first through hole penetrating the insulation layer

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 2

The first signal line is designed with a larger width and thickness to enhance heat dissipation and reduce IR drop

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12266747B2Light-emitting substrate, method for forming the light-emitting substrate and display device
Publication Date: 2025.04.01 BOE TECHNOLOGY GROUP CO LTD
  • US12266747B2 patent drawing

AI summary

The present disclosure discloses a light-emitting substrate, a method for forming the light-emitting substrate and a display device. The light-emitting substrate includes: a base substrate; a first signal line located at one side of the base substrate; an insulation layer located at one side of the first signal line away from the base substrate; an electrode layer located at one side of the insulation layer away from the base substrate and including a first electrode terminal, a second electrode terminal and a second signal line, where the first electrode terminal is electrically connected to the first signal line via a first through hole penetrating the insulation layer; and at least one light-emitting element bound and connected to the first electrode terminal and the second electrode terminal.