Light-Emitting Substrate Reflective Layer for Precise Mini LED Placement
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Solution Overview
Problem
Existing manufacturing methods for light-emitting substrates using mini LEDs and micro LEDs face issues such as reduced luminous efficiency due to reflective layer deposition on bonding pads, oxidation and yellowing during high-temperature processes, and errors in device positioning, leading to reduced display luminance and increased power consumption.
Innovation Solution
A method involving 3D printing of a reflective layer with protruding structures and openings to accommodate light-emitting devices, ensuring precise placement and avoiding deposition on bonding pads, thereby improving luminous efficiency and reducing errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a reflective layer is deposited using existing manufacturing methods, then the substrate structure is formed, but the reflective layer deposits on bonding pads causing reduced luminous efficiency
Solution Approach 1:
The reflective layer is segmented into multiple independent reflective elements arranged in arrays, with each element corresponding to a light-emitting device. This segmentation allows precise control of reflective material placement, preventing deposition on bonding pads while maintaining high luminous efficiency through controlled reflection pathways.
Solution Approach 2:
The reflective layer is applied selectively only in regions where reflection is needed, with different reflectivity characteristics in different zones. The reflective elements are positioned to reflect light from specific devices while avoiding bonding pad areas, creating local quality variations that optimize both energy efficiency and manufacturing precision.
2Ease of manufacture
If high-temperature processes are used for manufacturing, then the substrate is processed, but oxidation and yellowing occur reducing display quality
Solution Approach 1:
The manufacturing process utilizes an inert atmosphere environment during high-temperature processing to prevent oxidation and yellowing of the substrate and light-emitting devices. The inert atmosphere protects sensitive components while allowing necessary thermal processing to proceed, maintaining display quality despite the use of elevated temperatures for manufacturing.
3Productivity
If conventional manufacturing processes are used, then devices are assembled, but positioning errors occur reducing display luminance
Solution Approach 1:
Positioning features and alignment structures are prepared in advance on the substrate before light-emitting devices are assembled. The reflective elements and device mounting positions are pre-configured with precise geometric relationships, enabling accurate positioning during assembly without requiring complex real-time adjustment, thus maintaining both productivity and positioning accuracy.
Data Source
AI summary
A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.