Light-Emitting Substrate Layout for Protected Mini LED Interconnects
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing mini LED/micro LED display apparatuses face challenges in ensuring effective protection of light-emitting chips from external factors such as water vapor and oxygen, while maintaining high current carrying capacity and heat dissipation, which affects the reliability and performance of the display.
Innovation Solution
A light-emitting substrate design featuring a protective structure that covers the light-emitting chips, signal lines with specific contour arrangements to avoid short circuits, and a reflective layer to enhance heat dissipation and light efficiency, along with a substrate material that allows for flexible and curved displays.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective structure is added to cover the light-emitting chip, then the chip is protected from water vapor and oxygen, but the device complexity increases
Solution Approach 1:
The patent employs a protective structure comprising a first protective layer and a second protective layer that form a sealed enclosure over the light-emitting chip. These thin film layers provide environmental protection while maintaining a relatively simple and integrated structure, avoiding the need for complex rigid protective housings.
2Reliability
If signal lines are designed with specific contour arrangements to avoid short circuits, then the reliability improves, but the manufacturing precision requirements increase
Solution Approach 1:
The patent specifies that the contour of each signal line includes curved edges without corner points, and any two connected edges form an intersection with a specific angle range (30°-150°). This curved design eliminates sharp corners that could concentrate stress or create manufacturing defects, thereby preventing short circuits while maintaining manufacturability through standardized curvature requirements.
3Reliability
If the protective structure is positioned with safe distances from signal line intersections, then the protection effectiveness improves, but the area occupied by the protective structure increases
Solution Approach 1:
The patent applies protective coverage selectively, ensuring that the protective structure covers the light-emitting chip while maintaining safe distances from signal line intersections. The first and second protective layers are configured to provide adequate protection to the chip and surrounding sensitive areas without extending unnecessarily far, thus optimizing the balance between protection effectiveness and area utilization.
4Illumination intensity
If mini LED/micro LED chips are used to achieve high luminance and sharp display, then the display quality improves, but the heat dissipation challenge increases
Solution Approach 1:
The patent introduces a reflective layer as an intermediary component between the light-emitting chip and the underlying substrate. This reflective layer serves dual functions: it reflects light to enhance light efficiency and brightness, and it facilitates heat dissipation by providing a thermally conductive path from the high-luminance mini/micro LED chips to the substrate, thereby managing the heat generated by the high-intensity light emission.
Data Source
Figure 1~2
Figure 3
Figure 4~5
AI summary
Disclosed is a light-emitting substrate. The light-emitting substrate comprises a base, and a pad group, a light-emitting chip, a signal line group, and a protective structure which are located on the base. The pad group is connected to the light-emitting chip. The signal line group at least comprises two signal lines correspondingly connected to the pad group, the orthographic projection of the signal lines on the base has a first contour, the first contour comprises a plurality of sequentially connected edges, and any two connected edges have an intersection point. The protective structure is located on the side of the light-emitting chip away from the base, and the orthographic projection of the light-emitting chip on the base is located in the orthographic projection of the protective structure on the base. The orthographic projection of the protective structure on the base has a second contour. The intersection point comprises a target first intersection point located in the second contour and having the minimum distance from the second contour, and a safe distance is formed between the target first intersection point and the second contour; and/or the intersection point comprises a target second intersection point located outside the second contour and having the minimum distance from the second contour, and a safe distance is formed between the target second intersection point and the second contour.