Light-Emitting Substrate Reflective Layer for Higher Luminance
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Solution Overview
Problem
Existing manufacturing methods for light-emitting substrates using mini LEDs and micro LEDs face issues such as reduced luminous efficiency due to reflective layer deposition on bonding pads, oxidation and yellowing during high-temperature processes, and errors in device positioning, leading to reduced display luminance and increased power consumption.
Innovation Solution
A method involving 3D printing of a reflective layer on a substrate with precise openings and protruding structures to accommodate light-emitting devices, ensuring the reflective layer is formed after device fixation, thereby avoiding deposition on bonding pads and improving reflectivity and luminous efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the reflective layer is formed before light-emitting device fixation, then the manufacturing process is simpler, but the reflective layer deposits on bonding pads reducing luminous efficiency
Solution Approach 1:
The light-emitting devices are fixed onto the substrate before the reflective layer is formed. This preliminary action of device fixation prevents the reflective layer material from depositing on the bonding pads during the reflective layer formation process, thereby maintaining bonding pad reflectivity and luminous efficiency while still allowing for a relatively simple manufacturing process
2Manufacturing precision
If high-temperature processes are used for manufacturing, then the manufacturing precision is improved, but oxidation and yellowing occur reducing display quality
Solution Approach 1:
The patent employs an inert atmosphere or protective gas environment during the manufacturing process, particularly during reflow soldering and other high-temperature processes. This inert environment prevents oxidation of the light-emitting devices and bonding pads, and prevents yellowing of the substrate and adhesive layers, thereby maintaining display quality while still achieving the necessary manufacturing precision
3Manufacturing precision
If the distance between light-emitting device and opening sidewall is large, then the device positioning tolerance is improved, but the display luminance is reduced
Solution Approach 1:
The protruding structures on the reflective layer create continuous sidewalls that extend into the openings, providing both mechanical support and optical reflection. These continuous structures allow for larger distances between devices and opening sidewalls (improving positioning tolerance) while still maintaining display luminance through the reflective sidewalls that guide light toward the display surface
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances luminous efficiency and display luminance while reducing power consumption by preventing reflective layer deposition on bonding pads and minimizing errors in device positioning, thus improving the overall performance of backlight modules and display apparatuses.
Implementation Method 1
forming a reflective layer on the substrate by three-dimensional (3D) printing
Data Source
AI summary
A light-emitting substrate includes a substrate, and a plurality of light-emitting devices and a reflective layer that are disposed on a side of the substrate. The reflective layer has a plurality of openings, and the plurality of openings include a plurality of first openings; a light-emitting device is located in a first opening. A surface of the reflective layer away from the substrate has a plurality of protruding structures.