Light-Emitting Substrate Layout for Thin Mini LED Backlights
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Solution Overview
Problem
Existing Mini LED display technologies face challenges in achieving thinness and uniform light performance due to the size and placement of driver chips and light-emitting devices, which can affect optical effects and increase module thickness.
Innovation Solution
A light-emitting substrate design with integrated supporting structures that encapsulate driver chips, reducing their size constraints and optimizing their placement alongside light-emitting devices, while using transparent adhesives and reflective surfaces to enhance protection and light efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If driver chips are placed on the substrate without supporting structures, then the module thickness is reduced, but the driver chips are exposed to environmental factors and have limited placement flexibility
Solution Approach 1:
The driver chip is embedded within the supporting structure, which provides protection while maintaining a compact form factor. The supporting structure acts as a container that houses the driver chip, achieving both protection and space efficiency.
Solution Approach 2:
The supporting structure extends vertically from the substrate surface, creating a three-dimensional arrangement that protects the driver chip without significantly increasing the overall module footprint. This vertical dimension allows protection while maintaining thinness.
2Reliability
If driver chips are covered by supporting structures, then driver chip protection and placement flexibility are improved, but light extraction efficiency may be reduced due to obstruction
Solution Approach 1:
The supporting structure is designed with differentiated regions: the top surface provides protection for the driver chip, while the side surfaces are optimized for light transmission. This local differentiation allows simultaneous achievement of protection and light extraction efficiency.
Solution Approach 2:
The supporting structure uses transparent or translucent materials that allow light to pass through while providing mechanical protection. The material properties are selected to maintain optical clarity while achieving the protective function.
3Length of stationary object
If driver chip size is reduced to achieve thinner modules, then module thickness is reduced, but driver chip functionality and reliability are compromised
Solution Approach 1:
The supporting structure provides vertical space that allows standard-sized driver chips to be used without increasing the horizontal footprint. This three-dimensional arrangement enables full driver chip functionality while maintaining thin module profile.
Solution Approach 2:
The module is segmented into functional layers: the substrate layer for light-emitting devices, the supporting structure layer for driver chip mounting and protection, and the optical film layer for light management. This segmentation allows each component to be optimized independently.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves a thinner and more efficient backlight module with improved light extraction and reduced risk of display defects, ensuring uniform light output and enhanced durability of driver chips.
Implementation Method 1
The driver chip is connected to the supporting structure through a transparent adhesive
Implementation Method 2
using transparent adhesives and reflective surfaces to enhance protection and light efficiency
Data Source
AI summary
A light-emitting substrate includes a substrate, and a plurality of light-emitting devices, a plurality of driver chips and a plurality of supporting structures that are all disposed on a side of the substrate. Each driver chip is electrically connected to at least one light-emitting device, and each driver chip is covered by a supporting structure of the plurality of supporting structures.