Light-Transmitting Cooling Stage for Local Thermal Control
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Solution Overview
Problem
Existing electronic device inspection apparatuses face challenges in controlling the temperature of semiconductor wafers or carriers locally, leading to thermal loads on adjacent devices during inspection, which can cause issues and decrease yield and increase costs.
Innovation Solution
A placement stand with a cooling mechanism made of light-transmitting material and a light irradiation mechanism using LEDs, allowing for controlled heating and cooling of specific areas while maintaining overall object temperature, thereby minimizing thermal loads on adjacent devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a coolant flow path or heater is disposed in the stage to control temperature, then the temperature of the wafer can be controlled, but it is difficult to miniaturize the coolant flow path or heater to achieve local temperature control
Solution Approach 1:
The patent replaces the mechanical coolant flow path and heater system with an optical system using LEDs and light-transmitting materials. The LEDs emit light that passes through the light-transmitting stage to locally heat or cool specific electronic devices, eliminating the need for miniaturized mechanical thermal control components.
Solution Approach 2:
The patent introduces a light-transmitting stage as an intermediary medium between the LED light source and the electronic devices. This stage allows optical energy to be transmitted to the devices for thermal control while maintaining structural support, solving the miniaturization problem by using light as the thermal control medium.
2Object-affected harmful factors
If the entirety of the wafer is cooled by a coolant flow path, then thermal load on adjacent devices is reduced, but local temperature control for the inspected device cannot be achieved
Solution Approach 1:
The patent applies local quality by using multiple LEDs that can be independently controlled to irradiate light to specific locations on the wafer. Each LED or group of LEDs can target a specific electronic device, providing localized thermal control while other devices remain at ambient or cooled temperature, thus reducing thermal load on adjacent devices.
Solution Approach 2:
The patent segments the thermal control system into multiple independent LED units, each capable of controlling the temperature of a specific electronic device. This segmentation allows selective heating or cooling of individual devices without affecting the entire wafer, enabling both local temperature control and reduced thermal load on adjacent devices.
3Object-affected harmful factors
If implementation voltage is not applied to the inspected device, then thermal load on adjacent devices is avoided, but potential issues that occur when implementation voltage is applied cannot be detected
Solution Approach 1:
The patent applies implementation voltage to the inspected electronic device while using LED light to pre-cool or maintain the device at an appropriate temperature before and during voltage application. This preliminary thermal management allows the device to withstand implementation voltage without overheating adjacent devices, enabling early detection of potential issues before packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise temperature control of electronic devices during inspection, allowing for the application of higher implementation voltages to detect potential issues before packaging, thus preventing cost increases and yield deterioration.
Implementation Method 1
a coolant transmitting light flows in the cooling mechanism
Implementation Method 2
The light irradiation mechanism includes a plurality of LEDs oriented to the inspection object
Implementation Method 3
The cooling mechanism is formed of light-transmitting material, and a coolant transmitting light flows in the cooling mechanism
Data Source
AI summary
Provided is an electronic device inspection apparatus that suppresses cost increase. A prober is provided with a stage on which a carrier or a wafer is placed. The stage is provided with a stage cover on which the carrier is placed, a cooling unit in contact with the stage cover, and an LED irradiation unit facing the carrier across the stage cover and the cooling unit. Each of the stage cover and the cooling unit is formed of light-transmitting material. A light-transmitting coolant flows in a coolant flow path in the cooling unit. The LED irradiation unit has a plurality of LEDs oriented to the carrier. The carrier is formed of a glass substrate having a substantially disk-like shape. A plurality of electronic devices is arranged on a surface of the carrier at predetermined intervals.