Light-Transmitting Member for Uniform Substrate Gap
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Solution Overview
Problem
Existing imaging devices face challenges in uniformly disposing light blocking and sensor substrates at large gaps of approximately 50 μm or more, leading to issues like deformation of air layers, interfacial reflections, and volume changes during resin curing, which affect the accuracy of light detection.
Innovation Solution
The implementation of a light-transmitting member with a base and resin configuration, where the base covers the sensing region and the resin fills the gap between the substrates, reducing volume change and ensuring a uniform thickness, thereby maintaining a predetermined gap between the light blocking and sensor substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the light blocking substrate and sensor substrate are disposed at a large gap of approximately 50 μm or more, then light other than inspection light is blocked and detection accuracy is improved, but it is difficult to uniformly dispose the substrates and maintain a uniform gap
Solution Approach 1:
A resin layer is introduced as an intermediary material between the light blocking substrate and sensor substrate. This resin layer fills the gap and maintains a uniform thickness, enabling the substrates to be disposed at a large gap of approximately 50 μm or more while preserving gap uniformity. The resin acts as a mediator that compensates for the difficulty in directly maintaining uniform spacing at such large distances.
Solution Approach 2:
The invention changes the physical parameters of the gap by filling it with resin material having specific properties (refractive index, viscosity, curing characteristics). By controlling the resin's thickness and optical properties, the system achieves both large gap separation (50 μm or more) and uniform gap maintenance, resolving the contradiction between detection accuracy and manufacturing precision.
2Ease of manufacture
If the light blocking substrate and sensor substrate are disposed close to each other, then manufacturing is easier, but light other than inspection light is incident on the sensor and detection accuracy deteriorates
Solution Approach 1:
The resin layer serves as an intermediary that enables easy manufacturing (by providing a simple filling process) while simultaneously ensuring detection accuracy (by maintaining the required gap distance of 50 μm or more). The resin's flowable nature facilitates easy disposition, and its固化后的结构 maintains the precise spacing needed for accurate detection.
3Manufacturing precision
If resin material is used to fill the gap between substrates, then gap uniformity is improved, but volume change during curing causes substrate deformation
Solution Approach 1:
The invention carefully selects and controls the resin material's parameters, particularly its volume change characteristics during curing. By choosing resin with minimal volume change and controlling curing conditions, the system achieves gap uniformity while minimizing substrate deformation. The resin's refractive index is also optimized to match the surrounding materials, reducing optical interference.
Solution Approach 2:
The resin layer is designed to compensate for potential substrate deformation by providing a cushioning effect. Its viscoelastic properties allow it to absorb stresses during curing, preventing severe deformation while maintaining gap uniformity. The resin acts as a buffer that cushions the substrates against each other during the curing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for accurate and stable light detection by inhibiting extraneous light and reducing the influence of volume changes, enabling the substrates to be uniformly disposed at the desired gap, enhancing the imaging device's performance.
Implementation Method 1
the resin fills the gap between the substrates, reducing volume change and ensuring a uniform thickness
Data Source
AI summary
The imaging device includes a sensor substrate, a light-blocking substrate, a light-collecting substrate, a sealing material, and a light-transmitting member. The light-transmitting member includes a light-transmitting base disposed to be in contact with either the sensor substrate or the light-blocking substrate, and a light-transmitting resin which is filled between the base and the sensor substrate or the light-blocking substrate. A void is formed in at least a part of a space between the sealing material and the light-transmitting member.