Light Trapping Materials for Optical Crosstalk Reduction
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Solution Overview
Problem
Optical crosstalk in solid state imagers, such as CCD and CMOS imagers, leads to image degradation and contrast reduction due to stray light entering neighboring photosensors, which is exacerbated by decreasing pixel sizes and increasing pixel density, and existing light shields are imperfect and often reflect light, causing further errors.
Innovation Solution
Incorporating light trapping materials like nanotextured or porous silicon between layers in the imager structure to absorb stray light through total internal reflection, reducing optical crosstalk by creating a material with a higher index of refraction than the surrounding layers, thereby trapping light rays that would otherwise cause aberrations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If light shields are formed in upper device layers, then light shielding is provided, but light piping and shadowing increase, and optical crosstalk is not fully prevented
Solution Approach 1:
The light trapping structure extends vertically into the substrate below the photosensor surface, utilizing the third dimension (depth) to intercept stray light before it reaches neighboring photosensors. This vertical light trapping approach complements traditional lateral light shielding by operating in a different spatial dimension.
Solution Approach 2:
A dielectric layer is introduced as an intermediary material between the photosensor and the light trapping structure. This dielectric layer serves as a medium that allows light to pass through to the photosensor while also enabling the formation of the light trapping structure above it, mediating between light transmission and light trapping functions.
2Productivity
If pixel size is reduced to increase pixel density, then more pixels fit in the imager array, but optical crosstalk between neighboring photosensors increases
Solution Approach 1:
The light trapping structure is implemented as discrete elements associated with individual photosensors or groups of photosensors, segmenting the light management function at the pixel level. This allows each pixel region to independently trap its own stray light without interfering with adjacent pixels, enabling high pixel density while maintaining isolation.
3Object-affected harmful factors
If light shields are formed in metal interconnect layers, then light shielding is achieved, but conductive connections are limited and light still passes through imperfect shields
Solution Approach 1:
The light trapping structure utilizes a porous or textured dielectric material that provides effective light trapping through its physical structure rather than relying on opaque metal layers. This porous approach allows light to be scattered and trapped multiple times within the structure, achieving effective shielding without blocking electrical conductivity paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of light trapping materials significantly reduces optical crosstalk, enhancing image quality by ensuring that incident light is directed to the correct photosensor, minimizing blurring and contrast reduction, and reducing light piping and shadowing issues.
Implementation Method 1
Incorporating light trapping materials like nanotextured or porous silicon between layers in the imager structure to absorb stray light through total internal reflection
Implementation Method 2
creating a material with a higher index of refraction than the surrounding layers, thereby trapping light rays that would otherwise cause aberrations
Data Source
AI summary
An imager having layers of light trapping material to reduce optical crosstalk and a method of forming the same.


