Light Valve Module with Dedicated Heat Dissipation Region
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Solution Overview
Problem
Existing DLP projectors face challenges in effectively dissipating heat due to the limited contact area and inefficiency of the heat dissipation component, which is hindered by the small boss structure contacting the heat source.
Innovation Solution
A light valve module design incorporating an interposer substrate, thermal conductive component, and flexible circuit board, where the thermal conductive component is adjacently disposed with the interposer substrate and directly attached to the heat dissipation region of the light valve, enhancing thermal contact and area of contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a boss structure is used to contact the heat source directly, then the heat dissipation component can be mounted, but the contact area is limited and heat dissipation efficiency is insufficient
Solution Approach 1:
The patent transitions from a single-point boss contact structure to a planar heat dissipation region contact structure. The light valve's rear surface is designed with a heat dissipation region that provides a two-dimensional contact area with the thermal conductive component, fundamentally changing the contact geometry from zero-dimensional (point) to two-dimensional (surface), thereby dramatically increasing the contact area and heat dissipation efficiency.
Solution Approach 2:
The rear surface of the light valve is segmented into distinct functional regions: an electrical connection region and a heat dissipation region. This segmentation allows the heat dissipation component to be specifically positioned and contacted with the dedicated heat dissipation region, optimizing thermal contact without interfering with electrical connections, and thereby improving overall heat dissipation efficiency.
2Ease of manufacture
If the boss structure is constrained to penetrate through connector and flexible circuit board, then assembly is simplified, but the heat dissipation contact area remains small
Solution Approach 1:
The patent extracts the heat dissipation function from the mechanical boss structure and creates a dedicated heat dissipation region on the light valve's rear surface. This separated heat dissipation structure allows the thermal conductive component to contact the light valve directly over a large area without being constrained by the boss geometry, thereby achieving superior heat dissipation performance while maintaining assembly feasibility through the interposer substrate framework.
3Temperature
If the thermal conductive component is adjacently disposed with the interposer substrate, then the contact area with heat dissipation region is increased, but the structure becomes more complex
Solution Approach 1:
The interposer substrate serves multiple functions simultaneously: it provides electrical connection between the light valve and flexible circuit board, supports the thermal conductive component for heat dissipation, and maintains structural alignment between components. This multi-functionality reduces the need for separate dedicated structures for each function, thereby managing overall device complexity while achieving improved thermal conductance through the adjacently disposed thermal component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation efficiency by increasing the contact area between the thermal conductive component and the heat dissipation region, resulting in enhanced thermal conductance and effective heat management.
Implementation Method 1
the thermal conductive surface of the thermal conductive component is attached to the heat dissipation region of the connection surface of the at least one light valve
Data Source
AI summary
A light valve module and a projection device with the light valve module are provided. The light valve module includes a light valve, an interposer substrate, a thermal conductive component, and a flexible circuit board. The light valve includes a connection surface with a heat dissipation region and an electrical connection region. The interposer substrate includes a first surface and a second surface. The interposer substrate is disposed on the connection surface and is electrically connected to the at least one light valve by the first surface. The thermal conductive component is adjacently disposed with the interposer substrate and has a thermal conductive surface which is attached to the heat dissipation region. The flexible circuit board is disposed on the interposer substrate and the thermal conductive component, and the interposer substrate is electrically connected to the flexible circuit board by the second surface.