Light Emitting Wafer Separation Using Two-Step Laser Embrittlement
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Solution Overview
Problem
Current methods for manufacturing light emitting elements face inefficiencies in production, particularly due to unintended splits and damage during laser irradiation steps, which reduce yield and hinder increased production efficiency.
Innovation Solution
A light emitting element manufacturing method involving controlled laser beam irradiation with specific pitch and direction settings to generate embrittled regions within the substrate, allowing precise separation and minimizing unintended splits, using a combination of first and second irradiation steps with adjusted laser parameters to optimize substrate separation and reduce damage to the semiconductor structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If laser beam irradiation is performed to separate light emitting elements, then element separation is achieved, but unintended splits and damage to semiconductor structure occur
Solution Approach 1:
The laser irradiation process is divided into two distinct steps: first forming embrittled regions along separation lines, then inducing controlled cracks at specific locations. This segmentation of the separation process allows precise control over where cracks form, preventing unintended splits while achieving clean element separation.
Solution Approach 2:
Embrittled regions are formed in advance along the desired separation lines through first laser irradiation. This preliminary action creates predetermined weak zones that guide subsequent crack formation, ensuring cracks occur only at intended locations and not randomly throughout the substrate.
2Manufacturing precision
If conventional laser dicing method is used, then element separation is achieved, but production efficiency is insufficient
Solution Approach 1:
The laser beam irradiates multiple elements continuously along a line without stopping between elements. This continuous irradiation approach eliminates repeated positioning and setup operations, significantly improving production efficiency while maintaining precise separation through the embrittled region formation mechanism.
3Manufacturing precision
If laser beam is focused to form embrittled regions, then separation lines are created, but crack control becomes difficult
Solution Approach 1:
Different regions of the substrate receive different treatments: embrittled regions are formed along separation lines through focused laser irradiation, while crack initiation points are created at specific local positions. This local differentiation allows precise control over both separation line formation and crack location, preventing unintended splits.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances production efficiency by reducing unintended splits, increasing breaking strength, and ensuring stable irradiation conditions, leading to higher quality light emitting elements with improved yield and reduced damage to the semiconductor structure.
Implementation Method 1
irradiating a laser beam along first lines L1 to generate a plurality of embrittled regions 53a inside the substrate 50
Implementation Method 2
irradiating a laser beam along second lines L2 different from the first lines L1, and having a light collecting point inside of the substrate 50, thereby generating a plurality of embrittled regions 53b inside the substrate 50
Data Source
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AI summary
A method of manufacturing a light emitting element includes. providing a wafer including: a substrate, and a semiconductor structure; irradiating the substrate with a laser beam to form a plurality of modified regions in the substrate; and subsequently, separating the wafer into a plurality of light emitting elements. Irradiating the substrate with a laser beam includes: performing a first irradiation step comprising irradiating the laser beam along a plurality of first lines that extend in a first direction that is parallel to the first face and that are aligned in a second direction that is parallel to the first face and intersects the first direction, and subsequent to performing the first irradiation step, performing a second irradiation step comprising irradiating the laser beam along second lines that extend in the second direction.