Lightguide Plate Recesses for Thin Light Emitting Modules

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Solution Overview

Problem

Existing light source devices, such as those described in Japanese Patent Publication No. 2015-32373, face challenges in achieving sufficient thickness reduction due to the required distance between the mounting board and the diffusion plate, limiting their thinness and optical performance.

Innovation Solution

A method of manufacturing a light emitting module involving a lightguide plate with recesses, where light-transmitting members are arranged within these recesses, and wavelength conversion members are used to absorb and convert light, allowing for thinner designs and improved optical characteristics by adjusting the light-transmitting members to a uniform height and securely attaching light emitting elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Length of moving object

If a conventional light source device structure is used with a mounting board and diffusion plate, then the device can be assembled with standard components, but the overall thickness cannot be sufficiently reduced

Engineering Contradiction:
ImprovethicknessVSAvoidstructure
Core Design Contradiction:
Length of moving objectVSDevice complexity

Solution Approach 1:

The patent merges the mounting board and diffusion plate into a single integrated lightguide plate structure. The lightguide plate simultaneously serves as the mounting substrate for light emitting elements and the diffusion element for light distribution, eliminating the need for separate components and reducing overall thickness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The lightguide plate performs multiple functions: it acts as a mounting board for securing light emitting elements, as a diffusion plate for light distribution, and as a structural support component. This multi-functionality reduces the number of required components and enables thickness reduction.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Illumination intensity

If the distance between mounting board and diffusion plate is increased to ensure proper optical function, then light distribution improves, but the overall module thickness increases

Engineering Contradiction:
Improvelight distributionVSAvoidthickness
Core Design Contradiction:
Illumination intensityVSLength of moving object

Solution Approach 1:

The patent introduces local optical structures (lens portions or microlens arrays) at specific positions on the lightguide plate surface where light emitting elements are mounted. These localized optical features provide effective light diffusion and distribution functionality without requiring increased distance between mounting and diffusion surfaces.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The patent transitions from a conventional planar diffusion approach to a three-dimensional optical structure by forming lens portions that protrude from the lightguide plate surface. This vertical dimensionality provides enhanced light control and distribution while maintaining a compact overall thickness.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Adaptability or versatility

If light-transmitting members are arranged in recesses with varying heights, then the structure can accommodate different component requirements, but height variations reduce manufacturing precision

Engineering Contradiction:
Improvecomponent accommodationVSAvoidheight uniformity
Core Design Contradiction:
Adaptability or versatilityVSManufacturing precision

Solution Approach 1:

The patent performs preliminary height adjustment of light-transmitting members during the assembly process. The members are adjusted to a uniform height before subsequent manufacturing steps, ensuring consistent positioning and improving overall manufacturing precision while maintaining the ability to accommodate different components.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the creation of thinner light emitting modules with improved optical characteristics and reduced height variations, ensuring reliable exposure of electrodes and enhanced light transmission efficiency.

Implementation Method 1

placing a wavelength conversion member on the light-transmitting member for absorbing light from the light emitting element and converting the light into light of a different wavelength

Methodology Applied
Scientific EffectWavelength conversion: Photoluminescence

Data Source

PatentUS10950763B2Method of manufacturing light emitting module
Publication Date: 2021.03.16 NICHIA CORP
  • US10950763B2 patent drawing
  • US10950763B2 patent drawing
  • US10950763B2 patent drawing

AI summary

A method, comprising: providing a light emitting element including a semiconductor stack body and an electrode; providing a lightguide plate having a first surface and a second surface opposite to the first surface, wherein the second surface includes a plurality of recesses; arranging a light-transmitting member in each of the recesses; adjusting upper surfaces of the light-transmitting members to a uniform height; placing a wavelength conversion member on the light-transmitting member; placing the light emitting element on the wavelength conversion member with the electrode facing up; arranging a cover member that covers the light emitting element; removing the cover member until the electrode is exposed; and forming a wiring that electrically connects the light emitting elements together.