Lighting Device Circuit Board Frame Slot Mounting
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Solution Overview
Problem
Conventional lighting devices with circuit boards face challenges in thermal performance and high material costs due to the use of thermally conductive epoxy for heat dissipation, which also complicates recycling and increases weight.
Innovation Solution
A lighting device design featuring a circuit board frame with slots for mounting the circuit board, allowing for improved thermal contact and heat dissipation through a heat sink or ambient air, while reducing material costs and facilitating assembly and recycling by eliminating the need for potting material.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If thermally conductive epoxy is used to secure the PCB and conduct heat, then thermal performance is improved, but material cost increases
Solution Approach 1:
The patent extracts the circuit board from the potting material and secures it using a dedicated circuit board frame with mounting features. This eliminates the need for thermally conductive epoxy while maintaining thermal performance through direct contact with the heat sink via the frame structure.
Solution Approach 2:
The patent segments the mounting function from the thermal conduction function by introducing a separate circuit board frame structure. The frame provides mechanical support through slots and mounting holes, while thermal conduction is handled through direct contact surfaces with the heat sink, eliminating the need for epoxy material.
2Temperature
If the base is filled with potting material to secure the PCB, then thermal conduction is improved, but weight increases
Solution Approach 1:
The patent removes the potting material entirely from the base structure and replaces it with a circuit board frame that provides both mechanical support and thermal conduction pathways through its rigid structure and direct heat sink contact.
Solution Approach 2:
Instead of filling the base with potting material to achieve thermal conduction, the patent inverts the approach by creating a dedicated frame structure that provides thermal conduction surfaces directly against the heat sink, eliminating the need for filler materials.
3Reliability
If potting material is used to encapsulate the PCB, then electrical insulation is improved, but ease of repair deteriorates
Solution Approach 1:
The patent segments the electrical insulation function from the mechanical support function by using a circuit board frame structure. The frame provides mechanical support through slots and mounting holes, while electrical insulation is achieved through the frame material itself or separate insulating elements, allowing the circuit board to be easily removed and replaced.
Solution Approach 2:
The patent creates a dynamic mounting system where the circuit board can be easily inserted and removed from the frame structure. The slots and mounting features allow for quick assembly and disassembly, enabling easy repair and replacement without requiring destruction of encapsulating material.
4Strength
If the base is filled with epoxy to secure the PCB, then mechanical strength is improved, but manufacturing cost increases
Solution Approach 1:
The patent extracts the mechanical support function from the epoxy material and implements it through a dedicated circuit board frame structure with slots, mounting holes, and attachment features that provide secure mounting without requiring additional materials.
Solution Approach 2:
The circuit board frame serves multiple functions simultaneously: it provides mechanical support through its structural design, enables thermal conduction through contact surfaces with the heat sink, and provides electrical insulation through its material properties or integrated insulating elements, eliminating the need for separate epoxy material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal performance, reduces material costs, and simplifies recycling by providing a more efficient cooling system and lighter weight, thereby extending the lifespan of the lighting device and improving manufacturing efficiency.
Implementation Method 1
an edge of the circuit board is mounted in the slot such that the circuit board is in thermal contact with the circuit board frame, thereby enabling heat to be conducted from the circuit board to the circuit board frame
Implementation Method 2
the base may comprise a metal heat sink for cooling the LEDs and the driving electronics. The cooling is necessary for maintaining a sufficiently low operating temperature
Data Source
Figure 1a~1b
Figure 2a~2b
Figure 3a~4b
AI summary
The present invention relates to a lighting device (1). The lighting device comprises alight source (3), a circuit board (7) configured to control the light source, and a circuit board frame (10)comprising a slot (12). Further, an edge (8) of the circuit board is mounted in the slot such that the circuit board is in thermal contact with the circuit board frame, thereby enabling heat to be conducted from the circuit board to the circuit board frame. The present invention is advantageous in that the thermal performance of the lighting device is improved and manufacturing costs are reduced.