Lighting Device with Opposed-Side Component Segmentation
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Solution Overview
Problem
Existing solid state lighting devices face inefficiencies due to the visibility of electrical and electronic components, limited component choices, increased costs from using light-colored components, and complexities in sealing processes, which affect radiation patterns and IP protection.
Innovation Solution
The solution involves mounting light radiation sources on one side of a flexible polyimide board with conductive lines connecting them to drive circuits on the opposite side, allowing only the LEDs to be visible, using a single transparent sealing layer for IP protection, and enabling a wider range of LED options and increased component density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If all electrical and electronic components are mounted on the visible side of the board, then the device structure is simplified, but the radiation pattern becomes uneven and device efficiency is reduced
Solution Approach 1:
The board is divided into a first side and a second side, with light radiation sources mounted on the first side and electrical/electronic components mounted on the second side. This spatial segmentation separates the optical function from the electrical function, allowing optimal radiation patterns while maintaining structural simplicity.
2Ease of manufacture
If dark components are covered with a white silicone coating to mask visibility, then aesthetic appearance is improved, but the sealing process becomes more complex and costly
Solution Approach 1:
The electrical and electronic components are extracted from the visible side and mounted on the opposite side of the board. This eliminates the need for cosmetic masking of dark components, as they are naturally hidden by the board structure itself, thereby simplifying the sealing process to a single transparent coating step.
Solution Approach 2:
The solution moves the electrical components to another dimension (the opposite side of the board) rather than attempting to conceal them on the same plane. This dimensional relocation simultaneously achieves aesthetic goals and process simplification.
3Object-affected harmful factors
If the board surface is covered with a white silicone layer to mask dark components, then visibility of dark components is reduced, but light transmission to the LEDs is blocked and a second transparent coating step is required
Solution Approach 1:
The electrical components that cause the dark spot visibility issue are extracted to the opposite side of the board, eliminating the need for any cosmetic masking. This allows the use of a single transparent silicone coating that provides both sealing and optimal light transmission without the need for white masking layers.
4Reliability
If a two-step sealing process is used with white and transparent silicone layers, then IP protection is achieved and dark components are masked, but the process time increases and productivity decreases
Solution Approach 1:
By extracting electrical components to the hidden side of the board, the patent eliminates the need for cosmetic masking steps. This allows implementation of a single-step transparent silicone sealing process that simultaneously provides IP protection and maintains productivity, removing the sequential dependency of two-step processes.
5Adaptability or versatility
If the number of electrical and electronic components is increased to match the number of LEDs, then component functionality is enhanced, but the LED-to-LED pitch increases due to space constraints
Solution Approach 1:
The board is segmented into two sides: the first side dedicated to light radiation sources and the second side dedicated to electrical/electronic components. This segmentation allows high component density on each side without interference, enabling increased functionality while maintaining small LED-to-LED pitch through efficient spatial utilization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the silicone deposition process, reduces material usage, and allows for thinner modules with improved productivity and cost-effectiveness while maintaining efficient light transmission and protection.
Implementation Method 1
coated with a further transparent, i.e. light-permeable, layer (e.g. a silicone layer), so as to ensure an efficient light transmission
Data Source
AI summary
A lighting device may include a mounting board with first and second opposed faces and vias extending therethrough, one or more light radiation sources mounted on the first face of the mounting board, drive circuitry for the light radiation source mounted on the second face of the mounting board, with electrically conductive lines between the light radiation source and the drive circuitry passing through said vias, a vat-like holder housing the mounting board with the light radiation source and the drive circuitry mounted thereon. The holder has cavities for receiving therein the drive circuitry with the first face of the mounting board and the light radiation source mounted thereon facing outwardly of the holder. Over the first face of the mounting board at least one sealing layer is applied, which ensures an IP grade protection of device.