Solid State Lighting Heat Spreader Plate Thermal Management
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Solution Overview
Problem
Solid state lighting devices face challenges in reducing costs, weight, and packaging while maintaining efficiency and heat management, particularly due to the high initial cost and heat generation associated with using fewer LEDs to achieve comparable brightness, which increases power consumption and heat dissipation requirements.
Innovation Solution
The use of a large number of solid state light emitters, such as 18-21 LEDs, generating less than 5 Watts of heat, combined with a device-scale heat spreader plate made of thermally conductive material, allows for reduced material usage and cost by dissipating heat efficiently to the ambient environment, enabling the construction of lighting devices with lighter, non-metallic components and lower packaging costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If fewer LEDs are used to achieve comparable brightness, then device complexity is reduced, but heat generation increases and power consumption rises
Solution Approach 1:
The patent divides the lighting function into multiple discrete LED units (18-21 LEDs) rather than using fewer high-power LEDs. This segmentation allows each individual LED to operate at lower current levels, reducing heat generation per LED while collectively achieving the required brightness output. The multiple LEDs are distributed across the device structure, with each contributing to the overall luminosity without excessive heat accumulation.
2Ease of manufacture
If fewer LEDs are used, then manufacturing cost decreases, but heat dissipation requirements increase
Solution Approach 1:
The patent transitions from conventional planar heat dissipation to three-dimensional heat management by incorporating sidewalls that extend vertically from the base. These sidewalls provide additional surface area for heat dissipation in the vertical dimension, allowing heat to be rejected to ambient air from multiple surfaces (top, bottom, and sides) rather than relying solely on a flat heat spreader plane. This dimensional expansion reduces the thermal load on individual components.
3Loss of energy
If traditional heatsinks are used, then heat dissipation is effective, but device weight and size increase
Solution Approach 1:
The patent replaces traditional bulky heatsinks with thin-film heat spreader plates that have high thermal conductivity. These thin plates are bonded to the LED substrates and provide efficient heat conduction pathways without the mass and volume of conventional heatsink structures. The thin-film approach maintains effective heat dissipation while dramatically reducing device weight and packaging requirements.
4Temperature
If aluminum heatsinks are used, then thermal conduction is improved, but material cost and packaging requirements increase
Solution Approach 1:
The patent employs composite material structures where thin-film heat spreader plates are bonded to substrate materials. These composites combine the high thermal conductivity needed for heat dissipation with the mechanical support and electrical isolation properties of the substrate. The composite approach achieves effective thermal conduction with minimal material quantity, reducing both cost and packaging requirements compared to solid aluminum heatsinks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration results in a significant reduction in heat spreader plate material, longer device lifespan, and a 50% decrease in heat management needs, facilitating the use of more plastic and less metal, thereby lowering production and assembly costs while maintaining high luminosity and color rendering index.
Implementation Method 1
a heat spreader plate of thermally conductive material having a base in thermal communication with the plurality of solid state emitters, and at least one sidewall projecting from the base. The plurality of solid state emitters provides a thermal load upon application of an operating current and voltage, the heat spreader plate dissipating at least a portion of the thermal load to an ambient air environment.
Data Source
AI summary
A lighting device is disclosed comprising a plurality of light emitters and a heat spreader plate thermally coupled to the plurality of light emitters, wherein the plurality of solid state emitters provides a thermal load upon application of an operating current and voltage, the heat spreader plate dissipating substantially all of the thermal load to an ambient air environment.