Lighting Module Waterproof Adhesive Insulating Layer
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Solution Overview
Problem
Existing lighting modules lack waterproof structures, making them vulnerable to moisture, which can cause circuit shorts or corrosion.
Innovation Solution
A lighting module design that includes a circuit board with an insulating layer between the metal and circuit layers, featuring an opening in the metal layer to expose the insulating layer, allowing for the application of a thick waterproof adhesive between the insulating layer and the light guide plate, thereby preventing moisture damage to the light emitting diode.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional lighting module structure is used without waterproof structures, then the device complexity is low, but the reliability is poor due to vulnerability to moisture causing circuit short or corrosion
Solution Approach 1:
The patent implements a nested waterproof structure where the waterproof adhesive is positioned between the circuit board and light guide plate, creating a nested protective configuration that integrates waterproofing within the existing module structure without adding external components
Solution Approach 2:
The patent introduces a vertical dimension to waterproofing by creating a stepped structure with different height regions on the circuit board, allowing thick waterproof adhesive to be applied in specific areas. This dimensional change enables enhanced moisture barrier without increasing horizontal footprint or overall device complexity
2Reliability
If a thick waterproof adhesive is applied to prevent moisture damage, then the reliability improves, but the manufacturing precision requirements increase due to the need for specific adhesive thickness and positioning
Solution Approach 1:
The patent applies preliminary action by pre-forming the circuit board with distinct height regions (first height region and second height region) before adhesive application. This pre-structured surface guides the waterproof adhesive to specific locations and maintains controlled thickness, eliminating the need for post-application thickness control and reducing manufacturing precision requirements
Solution Approach 2:
The patent implements local quality by applying waterproof adhesive selectively in specific regions (second adhesive region) rather than uniformly across the entire circuit board. The adhesive is positioned where moisture protection is most critical, allowing variable adhesive thickness and coverage that optimizes both protection and manufacturing ease
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively enhances the water resistance of the lighting module, protecting the light emitting diode from moisture-related damage and ensuring reliable operation.
Implementation Method 1
The portion of the insulating layer is adhered to the light guide plate through the waterproof adhesive
Data Source
AI summary
A lighting module includes a circuit board, a light emitting diode, a light guide plate, and a waterproof adhesive. The circuit board has an insulating layer, a metal layer, and a circuit layer. The insulating layer is interposed between the metal layer and the circuit layer. The metal layer has an opening exposing a portion of the insulating layer. The light emitting diode has a light emitting surface and a non-light emitting surface facing the metal layer. The light guide plate is parallel or substantially parallel to the circuit board and is adjacent to the light emitting surface of the light emitting diode. An optical axis of the light emitting diode coincides with or substantially coincides with a symmetry axis of the light guide plate. The portion of the insulating layer is adhered to the light guide plate through the waterproof adhesive.