Lighting Module Non-Overlapping Carrier Layout for Thermal Management

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Solution Overview

Problem

Existing lighting modules with combined LED and driving electronics face challenges in achieving a compact design and low thermal resistance between LEDs and the heat sink, as well as interference between electronic components and optical interfaces.

Innovation Solution

A lighting module design where the driving electronics are partially arranged in a non-overlapping region with respect to the light emitting device carrier, utilizing a heat conducting element with a protrusion to separate thermal paths and reduce interference, allowing for efficient space use and improved thermal management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the driving electronics are arranged beneath the LED circuit board (overlapping carriers), then the lighting module achieves a compact design, but the thermal resistance between LEDs and the heat sink increases

Engineering Contradiction:
Improvelighting module sizeVSAvoidthermal resistance
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent transitions from a vertical stacking arrangement (overlapping carriers in the same vertical space) to a lateral arrangement (non-overlapping carriers positioned side-by-side). The LED circuit board and driver circuit board are positioned adjacent to each other in the horizontal plane rather than one above the other, fundamentally changing the spatial dimension used for component placement. This dimensional shift resolves the contradiction by decoupling the compactness requirement from the thermal management constraint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If the driving electronics are arranged on the same carrier as the light emitting devices, then the device complexity is reduced, but the thermal resistance increases and component lifetime decreases

Engineering Contradiction:
Improvecarrier structureVSAvoidcomponent lifetime
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The patent divides the circuit board structure into two separate carrier boards: an LED circuit board for mounting light emitting devices and a driver circuit board for mounting driving electronics. This segmentation physically separates the thermal zones of high-power LEDs and sensitive electronic components, preventing heat from one subsystem from adversely affecting the other. The separation improves reliability by protecting temperature-sensitive components from excessive heat while maintaining manageable device complexity through modular board design.

Inventive Principle:
Principle #1Segmentation

3Volume of moving object

If the second carrier is positioned closer to the optical interface, then the module becomes more compact, but the driving electronics may interfere with the optical interface design

Engineering Contradiction:
Improvemodule compactnessVSAvoidoptical interface design flexibility
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent applies local quality by positioning the driver circuit board in a specific lateral location that is optically non-intrusive. The driver board is placed in a region where it does not block or interfere with light paths, optical interfaces, or beam propagation. This localized positioning strategy allows the module to maintain compact dimensions while preserving optical design flexibility, as the driver electronics occupy a spatial zone that is functionally separate from the optical pathway.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design results in a more compact module with reduced thermal resistance and extended component lifetimes by preventing excessive heating between LEDs and driving electronics, while maintaining efficient thermal dissipation to the heat sink.

Implementation Method 1

an interface between the first carrier and the heat conducting element and an interface between the second carrier and the heat conducting element being displaced from one another

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP2569576B1Lighting module
Publication Date: 2016.07.06 SIGNIFY HOLDING BV
  • EP2569576B1 patent drawingFigure 1
  • EP2569576B1 patent drawingFigure 2
  • EP2569576B1 patent drawingFigure 3

AI summary

A lighting module (1) comprising at least one light emitting device (3) arranged on a first carrier (10); driving electronics (4) for driving the at least one light emitting device (3) arranged on a second carrier (11); and an optical interface (5) for outputting light emitted by the at least one light emitting device (3), wherein the second carrier (11) is arranged in a plane substantially parallel to the first carrier (10), wherein the first (10) and second (11) carriers are configured such that a projection of the first carrier (10) onto the plane is substantially non-overlapping with the second carrier (11) so as to form a non-overlapping region, wherein the driving electronics is at least partially arranged in the non-overlapping region. The inventive lighting module enables more efficient use of the space in the lighting module.