Vehicle Lighting Module Resin Structure for Uniform Light Extraction
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Solution Overview
Problem
Conventional light emitting diodes (LEDs) used in vehicle lamps have limited light emission area, leading to reduced design freedom and increased complexity in achieving uniform light distribution and extraction efficiency.
Innovation Solution
A lighting module comprising a substrate with multiple LEDs, a first resin layer covering the LEDs, and a second resin layer with phosphors and ink particles, which includes a curved surface design to enhance light extraction and distribution, and a coupling structure between covers to support the module.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a conventional LED is used as a vehicle lamp, then power consumption is reduced, but the light emitting area is limited and design freedom is reduced
Solution Approach 1:
The patent divides a single LED into multiple separate LED chips arranged on a circuit board. Each LED chip emits light in a specific direction, and together they create a larger effective light emitting area while maintaining low power consumption. The segmentation allows for flexible arrangement patterns to achieve desired light distribution.
Solution Approach 2:
The patent transitions from a single-point light source to a distributed array of multiple LED chips across a two-dimensional plane. This dimensional expansion increases the light emitting area without proportionally increasing power consumption, as multiple chips can share the total power load while providing broader illumination coverage.
2Adaptability or versatility
If multiple LEDs are used to increase light emitting area, then design freedom is improved, but light extraction efficiency and uniform distribution become more difficult to achieve
Solution Approach 1:
The patent introduces a translucent or transparent resin layer as an intermediary between the LED chips and the external environment. This resin layer serves multiple functions: it optically couples the LED chips, extracts light efficiently from multiple angles, and provides a uniform diffusing medium that eliminates hot spots. The resin may contain wavelength conversion particles to adjust the color temperature and improve overall light extraction efficiency.
Solution Approach 2:
The patent uses a homogeneous resin material that uniformly fills the space between and around the LED chips. This homogeneous medium ensures consistent light extraction from all LED chips, creates uniform light distribution across the entire emitting area, and eliminates variations in light intensity that would otherwise occur at chip boundaries or interfaces.
3Illumination intensity
If a resin layer is added to improve light extraction, then light distribution uniformity is improved, but device complexity increases
Solution Approach 1:
The patent merges multiple functions into the single resin layer: optical coupling, light extraction, wavelength conversion, and uniform diffusion. By combining these functions into one integrated component rather than separate elements, the design achieves improved light distribution uniformity without proportionally increasing structural complexity. The resin layer becomes a multi-functional element that simplifies the overall assembly.
Solution Approach 2:
The patent employs a composite material consisting of the resin base material combined with wavelength conversion particles (such as phosphors). This composite structure enables the resin to perform both optical coupling and wavelength conversion functions simultaneously. The composite material approach improves light extraction and distribution uniformity while adding minimal structural complexity, as the particles are dispersed within the existing resin matrix rather than requiring separate conversion layers.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light extraction efficiency, reduces hot spots, and achieves uniform light distribution while simplifying the assembly process and design flexibility.
Implementation Method 1
the second resin layer includes at least one of a phosphor and ink particles
Implementation Method 2
the second resin layer includes at least one of a phosphor and ink particles
Data Source
AI summary
The lighting assembly disclosed in the embodiment of the invention includes a substrate, light emitting devices on the substrate, a first resin layer covering the light emitting devices, and at least one second resin layer on the first resin layer, and a first cover disposed on an outer periphery of the substrate along an outer periphery of the substrate of the lighting module. The second resin layer is disposed on upper and side surfaces of the first resin layer, and the second resin layer includes at least one of phosphor and ink particles. The first cover includes an opening portion from which the second resin layer protrudes, a substrate cover portion disposed on an upper surface of the substrate around the opening portion, and a side cover portion extending lower than a side surface of the substrate from the substrate cover portion. An upper surface of the substrate cover portion may be disposed lower than the upper surface of the first resin layer.


