Lighting Source Mounting Device Uniform Pressure Distribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for mounting lighting sources, such as LED Chip-on-Board (CoB), on substrates like heat sinks do not ensure uniform pressure distribution, leading to inconsistent thermal interface properties and potential deterioration over time.
Innovation Solution
A mounting system comprising a frame with a central cavity, a sliding locking member, interference pins, elastic fins, and adjustable screws or rivets, which allows for uniform force distribution and thermal expansion, ensuring consistent thermal contact through the use of resilient members and ramp-like guides.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws are used to mount the lighting source on the substrate, then mechanical contact is ensured, but uniform pressure distribution is not achieved
Solution Approach 1:
The mounting device divides the contact interface into multiple discrete contact points through protrusions on the substrate and corresponding recesses on the lighting source holder. This segmentation allows for localized pressure application while maintaining overall mechanical stability, resolving the contradiction between ensuring mechanical contact and achieving uniform pressure distribution.
Solution Approach 2:
The patent implements local quality by creating specific geometric features (protrusions and recesses) at critical contact locations rather than relying on uniform surface contact. This allows different regions of the mounting interface to have specialized functions: some areas provide mechanical anchoring while others optimize thermal contact, thereby achieving both mechanical contact strength and improved pressure distribution.
2Reliability
If uniform pressure distribution is not achieved, then thermal interface properties deteriorate over time, but increasing mounting pressure may damage the lighting source
Solution Approach 1:
The mounting device incorporates elastic elements that provide dynamic adaptation to thermal expansion and contraction of the lighting source and substrate. This dynamic capability maintains consistent thermal interface pressure over time without requiring excessive initial mounting pressure, thereby ensuring thermal interface stability while protecting the lighting source from damage.
Solution Approach 2:
The patent employs elastic or compliant mounting elements that anticipate and accommodate thermal cycling effects before they cause damage. These elements provide a cushioning effect that absorbs thermal stresses and maintains reliable thermal contact throughout the operational life of the lighting source, preventing deterioration without applying damagingly high pressures.
3Stress or pressure
If the mounting device is made complex to achieve uniform pressure distribution, then manufacturing cost increases, but simple mounting devices cannot ensure reliable thermal contact
Solution Approach 1:
The mounting device utilizes the self-aligning properties of the protrusion-recess geometric features to automatically achieve uniform pressure distribution during assembly. The complementary shapes guide the lighting source into proper alignment and ensure consistent contact pressure without requiring complex adjustment mechanisms or multiple fastening points, thereby achieving reliable thermal contact with minimal device complexity.
Solution Approach 2:
The patent employs curved or rounded geometric features in the protrusions and recesses that naturally distribute contact pressure more uniformly compared to sharp-edged or flat features. This use of curvature simplifies the mounting device structure while effectively achieving uniform pressure distribution and reliable thermal contact.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves uniform pressure distribution and efficient thermal contact across the lighting source, enabling optimal heat transfer and easy interchangeability while accommodating thermal expansion, with adjustable pressure regulation based on thermal requirements.
Implementation Method 1
elastic fins distributed over the perimeter so as to contain the lighting source inserted therein, maintaining the possibility of free expansion and compression within the frame owing to the heat cycles
Implementation Method 2
elastic members to be provided so as to press the lighting source resiliently against a substrate, such as a heat sink
Implementation Method 3
thermal interface properties and the heat transfer are not constant on the contact surface and may easily deteriorate over time
Implementation Method 4
maintaining the possibility of free expansion and compression within the frame owing to the heat cycles
Data Source
AI summary
A device for mounting lighting sources on a substrate includes a mounting frame provided with fixing formations for fixing on the substrate, the mounting frame defining a cavity for receiving the lighting source which rests on the substrate. A locking member may be provided which can be positioned in the cavity of the mounting frame to urge said lighting source toward the substrate. At least one of the mounting frame and the locking member may include at least one retaining formation for the lighting source, including one or more pins extending into corresponding openings in the lighting source, and/or one or more elastic fins extending from the mounting frame to elastically contact the lighting source.


