Lighting Device Resin Layer and Indirect Reflection
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Solution Overview
Problem
Conventional lighting devices using light guide plates are limited in thickness, inflexible, and suffer from light loss and reduced light efficiency due to the thickness of the light guide plate, which also affects the LEDs' luminous intensity and wavelength stability.
Innovation Solution
A lighting device design that replaces the light guide plate with a resin layer and incorporates an indirect light emission unit and a reflection unit on a printed circuit board, enhancing heat dissipation, flexibility, and light reflectance, while eliminating the need for additional light sources and reducing the thickness of the device.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light guide plate is used to uniformly supply light from LEDs, then light uniformity is improved, but the device thickness increases and flexibility is reduced
Solution Approach 1:
The patent extracts and removes the light guide plate from the lighting device structure. By eliminating this thick plastic component, the device achieves reduced thickness and improved flexibility while maintaining light uniformity through alternative optical designs using thin-film reflection and diffusion layers integrated directly into the PCB structure.
Solution Approach 2:
The PCB is designed to serve multiple functions: it provides structural support, electrical connectivity, heat dissipation, and optical functions through integrated reflection and diffusion layers. This multi-functional design replaces the separate light guide plate, achieving both thinness and light uniformity without requiring additional thick components.
2Illumination intensity
If a light guide plate is used to supply light uniformly, then light distribution is improved, but light efficiency is reduced due to light loss
Solution Approach 1:
The patent converts the previously wasted side-emitted light into useful illumination by implementing reflection units on the PCB that redirect this light upward through the diffuser. This transforms light loss into beneficial light distribution, improving both efficiency and uniformity simultaneously.
Solution Approach 2:
The PCB incorporates localized reflection units with specific reflectivity properties in areas where light redirection is needed, and localized diffusion areas with specific transmission properties where light uniformity is required. This spatially varying optical property distribution optimizes both efficiency and uniformity without requiring a thick light guide plate.
3Length of moving object
If the device structure is made thin by removing the light guide plate, then device thickness is reduced, but heat dissipation becomes more difficult
Solution Approach 1:
The patent introduces a thermally conductive adhesive layer as an intermediary between the LEDs and PCB that serves dual functions: optically, it provides reflection to redirect light upward; thermally, it provides a low-resistance heat transfer path to the PCB's heat dissipation structures. This intermediary enables simultaneous achievement of thinness and effective heat dissipation.
4Ease of manufacture
If the lighting device uses a conventional structure with light guide plate, then manufacturing is simplified, but design flexibility is reduced
Solution Approach 1:
The patent merges the optical functions (reflection, diffusion) and structural functions into the PCB itself, eliminating the need for separate light guide plate components. This integration simplifies the overall manufacturing process by reducing component count and assembly steps while simultaneously enabling greater design flexibility since the PCB can be easily shaped and configured for different applications.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for thinner, more flexible lighting devices with improved light efficiency, reduced hot spots, and stable brightness, enabling various design options and enhanced manufacturing efficiency.
Implementation Method 1
an indirect light emission unit which is formed in at least one of one side and another side of the light source module and which reflects light irradiated from the light source
Implementation Method 2
a resin layer disposed on the printed circuit board so that the light source is embedded
Implementation Method 3
An LED (Light Emitted Diode) device is a device which converts an electrical signal to infrared rays or light using a property of compound semiconductor
Data Source
AI summary
Provided is a lighting device, comprising: a light source module comprising: at least one light source disposed on a printed circuit board; and a resin layer disposed on the printed circuit board so that the light source is embedded; an indirect light emission unit which is formed in at least any one of one side and another side of the light source module and which reflects light irradiated from the light source; and a diffusion plate having an upper surface which is in contact with an upper part of the light source module, and a side wall which is integrally formed with the upper surface and formed to extend in a lower side direction and which is adhered onto an outer side surface of the indirect light emission unit, whereby flexibility of the product itself can be secured, and durability and reliability thereof can be also improved.