Lighting Assembly Substrate Opening for Optical Interference Reduction
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Solution Overview
Problem
Current lighting assemblies face challenges in securely incorporating variable optical configurations without interfering with electronic components, as electrical components often cause optical interference and are difficult to mount securely with third-party components like optical elements or heat sinks.
Innovation Solution
A lighting assembly design featuring a substrate with electronic components on one side and a light emitting element positioned within an opening, allowing for a flipped substrate board configuration that reduces optical interference and enables thermal coupling with a housing, which can be securely attached to optical and heat management components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electronic components are disposed on the same side as the light emitting element, then device integration is simplified, but optical interference occurs and secure mounting to third party components becomes difficult
Solution Approach 1:
The substrate is divided into two functional sides: one side hosts electronic components while the other side accommodates the light emitting element and optical components. This segmentation separates interfering elements spatially, allowing each side to optimize its function without compromising the other.
Solution Approach 2:
The design transitions from a single-sided planar arrangement to a dual-sided three-dimensional configuration. By utilizing both sides of the substrate vertically, the design achieves better spatial separation of electronic and optical components while maintaining compact integration.
2Ease of manufacture
If electronic components are disposed on the same side as the light emitting element, then manufacturing is simplified, but secure mounting to optical elements or heat sinks becomes difficult
Solution Approach 1:
The substrate separates mounting functions from electronic component placement. The side without electronic components provides unobstructed access for mounting optical elements and heat sinks, while the other side maintains simplified electronic assembly.
Solution Approach 2:
The substrate acts as an intermediary platform that mediates between electronic components and external mounting requirements. It provides electrical connectivity and structural support while enabling secure attachment to third-party components through its unobstructed surface.
3Object-affected harmful factors
If the substrate configuration prevents optical interference, then light quality is improved, but thermal management becomes more challenging
Solution Approach 1:
Heat dissipation functions are extracted and dedicated to the housing structure rather than being integrated with the optical path. The housing provides specialized thermal management through heat sinks and ventilation paths that do not interfere with light emission.
Solution Approach 2:
The substrate serves as a thermal intermediary, conducting heat away from the light emitting element to the housing while maintaining optical clarity. This separation allows independent optimization of thermal paths without compromising optical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design allows for adaptable and secure integration of variable optical configurations while minimizing optical interference and enhancing thermal management, enabling efficient heat dissipation and compatibility with external components.
Implementation Method 1
a light emitting element attached to the substrate on the first side and positioned within the opening of the substrate
Implementation Method 2
a housing configured to thermally couple to the light emitting element
Data Source
AI summary
Some embodiments of the invention comprise a lighting assembly comprising including a substrate including a first side, a second side and an opening. The lighting assembly includes several electronic components disposed on the first side of the substrate. The lighting assembly includes a light emitting element attached to the substrate on the first side and positioned within the opening of the substrate.