LiNbO3 Elastic Wave Electrode Stack for Low-Loss Frequency Stability

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Solution Overview

Problem

Existing elastic wave devices face issues with high loss, inadequate frequency temperature characteristics, generation of spurious in higher-order modes, and deterioration in intermodulation distortion (IMD) when using single-layer IDT electrodes or multilayer metal films.

Innovation Solution

The elastic wave device incorporates a piezoelectric substrate made of LiNbO3 with an IDT electrode structure comprising a first electrode layer of high-density metals like Pt, W, Mo, Ta, or Au, and a second electrode layer of Al, along with a silicon oxide film containing hydrogen atoms or hydroxyl groups, optimized in thickness and duty ratio to reduce unwanted waves and improve frequency stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single-layer IDT electrode is used, then device complexity is reduced, but resistance of electrode fingers increases and loss increases

Engineering Contradiction:
Improveelectrode structureVSAvoidloss
Core Design Contradiction:
Device complexityVSLoss of energy

Solution Approach 1:

The IDT electrode uses a composite multilayer metal film structure consisting of a first metal film (high density material such as Pt, W, Mo, Ta, or Au) and a second metal film (Al or Cu). This composite structure combines the advantages of different materials: the high-density first layer provides mechanical stability and appropriate acoustic velocity, while the highly conductive second layer reduces resistance and energy loss.

Inventive Principle:
Principle #40Composite materials

2Loss of energy

If a multilayer metal film IDT electrode is used, then loss is reduced, but frequency temperature characteristics are insufficient

Engineering Contradiction:
ImprovelossVSAvoidfrequency temperature characteristics
Core Design Contradiction:
Loss of energyVSTemperature

Solution Approach 1:

A silicon oxide film is deposited on the piezoelectric substrate to compensate for frequency temperature characteristics. The film thickness is specifically controlled (0.01λ ≤ thickness < 0.06λ) to achieve optimal temperature compensation without generating excessive spurious signals. Additionally, the first metal film density is carefully selected to balance acoustic velocity control with temperature stability.

Inventive Principle:
Principle #35Parameter changes

3Temperature

If a silicon oxide film is provided to improve frequency temperature characteristics, then temperature stability is improved, but spurious in higher-order mode is generated

Engineering Contradiction:
Improvefrequency temperature characteristicsVSAvoidspurious
Core Design Contradiction:
TemperatureVSObject-generated harmful factors

Solution Approach 1:

The silicon oxide film thickness is precisely controlled within the range of 0.01λ ≤ thickness < 0.06λ, where λ is the acoustic wavelength. This specific thickness range provides sufficient temperature compensation while minimizing the generation of spurious signals in higher-order modes. The first metal film density is also optimized to further suppress spurious generation.

Inventive Principle:
Principle #35Parameter changes

4Reliability

If all characteristics (loss, temperature characteristics, spurious reduction) are improved, then device performance is enhanced, but IMD deteriorates

Engineering Contradiction:
Improvedevice performanceVSAvoidIMD
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

The first metal film density is specifically selected from high-density materials (Pt, W, Mo, Ta, Au) to optimize the balance between multiple characteristics. This density range provides appropriate acoustic velocity for reducing spurious while maintaining good temperature characteristics and acceptable loss levels, thereby preventing IMD deterioration despite other performance improvements.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution results in an elastic wave device with low loss, excellent frequency temperature characteristics, reduced spurious in higher-order modes, and improved IMD, making it suitable for high-frequency applications.

Implementation Method 1

an IDT electrode provided on the piezoelectric substrate... the elastic wave device utilizes a Rayleigh wave

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Implementation Method 2

the silicon oxide film contains a hydrogen atom, a hydroxyl group, or a silanol group

Methodology Applied
Scientific EffectCompositional modification for temperature compensation:

Data Source

PatentUS11595024B2Elastic wave device, high-frequency front end circuit, and communication apparatus
Publication Date: 2023.02.28 MURATA MFG CO LTD
  • US11595024B2 patent drawing
  • US11595024B2 patent drawing
  • US11595024B2 patent drawing

AI summary

An elastic wave device includes a piezoelectric substrate, an IDT electrode on the piezoelectric substrate, and a silicon oxide film arranged on the piezoelectric substrate to cover the IDT electrode. The IDT electrode includes first and second electrode layers laminated on each other, the first electrode layer is made of metal or an alloy with a density higher than a density of metal of the second electrode layer and a density of silicon oxide of the silicon oxide film, the piezoelectric substrate is made of LiNbO3 and θ is in a range of equal to or greater than about 8° and equal to or less than about 32° with Euler Angles (0°±5°, θ, 0°±10°) of the piezoelectric substrate, and the silicon oxide film contains hydrogen atoms, hydroxyl groups, or silanol groups.