Line Camera Inspection Distortion Correction for Semiconductor Transfer
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Solution Overview
Problem
Existing semiconductor process inspection methods face challenges in accurately capturing images of objects being transferred at varying speeds, leading to distortion and requiring additional space and time for line scan inspections.
Innovation Solution
An inspection apparatus with a line camera installed above a transfer path, capable of capturing images during acceleration and deceleration sections, and a controller that corrects image distortion to generate a result image for comparison with a reference image, allowing for efficient line scan inspections without additional space or time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If line scan inspection is performed during transfer process, then inspection efficiency is improved, but image distortion occurs due to transfer speed changes
Solution Approach 1:
The system changes the parameter of transfer speed from constant to variable (acceleration and deceleration sections), allowing inspection during the transfer process while managing the resulting image distortion through correction algorithms
Solution Approach 2:
The controller receives transfer speed information from the transferer and uses this feedback to correct image distortion. The system dynamically adjusts image processing based on real-time transfer speed changes to maintain inspection accuracy
2Manufacturing precision
If separate inspection space is provided, then image quality is maintained, but device complexity and space requirements increase
Solution Approach 1:
The inspection function is merged with the transfer process by installing the line camera above the transfer path. This eliminates the need for separate inspection spaces and stages, reducing device complexity while maintaining inspection capability
Solution Approach 2:
The transfer path serves dual purposes: both transferring the semiconductor wafer and serving as the inspection field. The line camera captures images during transfer, making the transfer mechanism universally serve both transport and inspection functions
3Adaptability or versatility
If transfer speed is varied for process control, then process flexibility is improved, but image distortion increases
Solution Approach 1:
The controller receives transfer speed information in advance and performs preliminary correction on the captured image based on the known speed changes. This allows the system to accommodate variable transfer speeds while maintaining inspection accuracy through pre-computed corrections
Data Source
AI summary
An inspection apparatus for a semiconductor process and a semiconductor process device, the inspection apparatus including a transferer configured to transfer a process object between a plurality of chambers; at least one line camera installed above the transferer, the at least one line camera being configured to generate an original image by capturing an image of the process object transferred by the transferer; and a controller configured to receive the original image and to perform an inspection of the process object by correcting distortion of the original image due to a change in transfer speed of the transferer.