Line Plating Rollers for Uniform PV Metal Grid Deposition
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current photovoltaic grid line manufacturing methods, such as rack plating and horizontal plating, suffer from non-uniform thickness, high labor requirements, low automation, and inefficiencies due to residual metals and copper ion consumption, limiting production capacity and increasing costs.
Innovation Solution
A manufacturing method and apparatus using line plating rollers with conductive parts that rotate through line plating and deplating regions, incorporating corrosion inhibition zones, to self-consume residual metals and ensure uniform metal layer deposition on semiconductor devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If rack plating method is used, then manufacturing process is simple, but line plating thickness uniformity is poor and production efficiency is low
Solution Approach 1:
The plating device is segmented into multiple independent line plating rollers, each responsible for plating a specific line. This segmentation allows each roller to be independently controlled and optimized, ensuring uniform thickness across multiple lines while maintaining the simplicity of the overall process.
Solution Approach 2:
The line plating rollers are designed to rotate during the plating process, creating dynamic contact between the conductive parts and the substrate. This rotational motion ensures uniform distribution of metal deposition, solving the thickness uniformity problem while keeping the manufacturing process straightforward.
2Device complexity
If rack plating method is used, then equipment structure is simple, but automation degree is low and labor requirement is high
Solution Approach 1:
The line plating rollers are designed to automatically rotate and perform plating operations without manual intervention. The system feeds substrates continuously through the plating zone, and the rollers automatically deposit metal lines, eliminating the need for manual racking and unracking operations while maintaining relatively simple equipment structure.
3Productivity
If conventional plating method is used, then production capacity is limited, but residual metals accumulate on line plating device
Solution Approach 1:
The system incorporates a deplating mechanism that removes residual metals from the line plating rollers during or after the plating process. This recovery process prevents metal accumulation on the device while maintaining continuous production capacity, as the rollers are repeatedly plated and deplated in an automated cycle.
4Area of stationary object
If single-sided plating is used, then production line is long and device occupation area is large, but double-sided electroplating demand cannot be satisfied
Solution Approach 1:
The plating device merges single-sided and double-sided plating capabilities into a single compact unit. By arranging line plating rollers to plate both sides of substrates in sequence within the same device footprint, the system achieves double-sided electroplating functionality without requiring a long production line or large device occupation area, thereby maintaining high production efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and apparatus achieve uniform metal layer deposition with reduced residual metals, enabling efficient double-sided electroplating and increasing production capacity while lowering costs.
Implementation Method 1
a surface of the semiconductor device is plated with metal lines in a movement direction thereof by conductive parts located in a circumferential direction of an outer side of each of the line plating rollers
Implementation Method 2
an anode is disposed on outer sides of the deplating regions and is electrically connected to a positive electrode of the power source by the conductive parts in the deplating regions
Data Source
AI summary
The disclosure discloses a manufacturing method and apparatus for an electronic component, and belongs to the technical field of manufacture of photovoltaic devices. The manufacturing method includes: putting a semiconductor device into a cathode region, and driving the semiconductor device to move in the cathode region, at the same time, connecting line plating rollers to a power source, and driving the line plating rollers to rotate, so that a surface of the semiconductor device is plated with metal lines in a movement direction thereof by conductive parts located in a circumferential direction of an outer side of each of the line plating rollers; the conductive parts include line plating regions and deplating regions; an anode is disposed on outer sides of the deplating regions and is electrically connected to a positive electrode of the power source by the conductive parts in the deplating regions.