Linear Carrier Transfer Layout for Clean, High-Throughput Substrate Handling

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Solution Overview

Problem

Conventional substrate treatment systems experience a decrease in throughput due to substrates passing through the single-wafer treatment device, and there is a risk of particle contamination during substrate transport.

Innovation Solution

A substrate treatment system is configured with a stocker device, a single-wafer treatment device, an interface device, and a batch treatment device disposed in a line, utilizing a carrier transport mechanism to transport carriers between the stocker device and the interface device, thereby preventing substrates from passing through the single-wafer treatment device and minimizing particle contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If substrates are transported individually through the single-wafer treatment device, then treatment flexibility is improved, but throughput decreases

Engineering Contradiction:

Improvetreatment flexibilityVSAvoidthroughput

Core Design Contradiction:

Adaptability or versatilityVSProductivity

Solution Approach 1:

The system segments substrate transport into two distinct paths: individual substrate transport via the single-wafer treatment device for flexible treatment, and batch carrier transport for high-throughput processing. This segmentation allows the system to optimize for both flexibility and throughput by selecting the appropriate transport mode based on treatment requirements.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The interface device acts as an intermediary between the stocker device and the batch treatment device. It receives carriers from the stocker, extracts substrates for single-wafer treatment, and returns processed substrates to carriers for batch processing. This intermediary role enables seamless coordination between individual and batch treatment modes, maintaining both flexibility and throughput.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Manufacturing precision

If substrates are transported individually, then treatment precision is improved, but particle contamination risk increases

Engineering Contradiction:

Improvetreatment precisionVSAvoidparticle contamination

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The carrier serves as a protective enclosure (flexible shell) that contains substrates during transport between the stocker device, interface device, and batch treatment device. This enclosed transport method protects substrates from particle contamination while allowing precise individual treatment when substrates are temporarily extracted at the interface device.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The interface device serves as a controlled intermediary zone where substrates are temporarily extracted from carriers for single-wafer treatment. This controlled environment minimizes exposure to contamination sources while maintaining treatment precision, then returns substrates to the protected carrier environment for batch processing.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Device complexity

If a linear arrangement of devices is used, then system complexity is reduced, but transport distance increases

Engineering Contradiction:

Improvesystem complexityVSAvoidtransport distance

Core Design Contradiction:

Device complexityVSLength of moving object

Solution Approach 1:

The system merges the functions of substrate storage, individual treatment, and batch treatment into a linear sequence of integrated devices. The stocker device, interface device, and batch treatment device are combined in a linear arrangement with unified carrier transport, reducing overall system complexity despite the increased transport distance, as the linear layout eliminates complex routing requirements.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS20250029861A1Substrate treatment system

Publication Date: 2025.01.23 SCREEN HOLDINGS CO LTD

AI summary

In a substrate treatment system, a stocker device, a single-wafer treatment device, an interface device, and a batch treatment device are disposed in a line and linearly in this order. A first transport robot of the stocker device transports a carrier placed on a load port to a stocker device side position. A carrier transport mechanism transports the carrier from the stocker device side position to an interface device side position. A second transport robot of the interface device transports the carrier from the interface device side position to a shelf. The batch treatment device takes out a plurality of substrates from the carrier transported to the shelf, and performs predetermined batch treatment on the plurality of taken-out substrates. The single-wafer treatment device performs treatment on a plurality of substrates one by one.