Linear Encoder Slider Pillar Through Hole Integration
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Solution Overview
Problem
Conventional linear encoders face high machining costs and potential defects due to the difficulty in forming small, long through holes for electric wires, which complicates wiring and reduces the strength of the pillar supporting the detection head holding unit.
Innovation Solution
The slider enclosure integrates a through hole by boring a part of the pillar closer to the detection head holding unit, allowing for integral molding or milling machining, reducing the length of the through hole and simplifying the wiring process while maintaining sealing performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If through holes are formed in post processing by drill machining or discharge machining, then electric wires can pass through, but machining cost increases significantly
Solution Approach 1:
The through holes are formed during the integral molding process itself, before the actual assembly and wiring operations. This preliminary formation of holes eliminates the need for subsequent expensive post-processing machining operations, directly reducing manufacturing costs while maintaining the ability to pass electric wires through the pillar and detection head holding unit
2Ease of manufacture
If through holes are formed in post processing, then electric wires can be routed, but the number of machining steps increases
Solution Approach 1:
The formation of through holes is merged with the integral molding process of the slider enclosure. Instead of being a separate post-processing step, the hole formation is integrated into the primary manufacturing operation, reducing the total number of discrete machining steps while maintaining wiring functionality
3Ease of manufacture
If drill machining is used on the thin pillar, then through holes can be formed, but the pillar surface may break through causing machining defects
Solution Approach 1:
The mechanical drill machining process is replaced with an integral molding process that forms through holes without mechanical contact or cutting forces. This substitution eliminates the risk of drill-induced surface breaking or machining defects on the thin pillar structure, while still achieving the required through-hole geometry for wire passage
4Volume of moving object
If the pillar is made very thin to reduce size, then the encoder becomes more compact, but the pillar strength decreases and may break during machining
Solution Approach 1:
The integral molding process replaces mechanical drilling, eliminating machining forces that could break thin pillars. This allows the pillar to be manufactured at the minimum necessary thickness for structural support without adding excess material, achieving compact encoder dimensions while maintaining pillar strength through appropriate material selection and molding process control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces machining costs and simplifies the wiring process, providing a more cost-effective slider unit with improved structural integrity for the linear encoder.
Implementation Method 1
a light-emitting unit 7, a mirror 8, and a light-receiving unit 29. In the detection head, the light emitted from the light-emitting unit 7 is reflected on the mirror 8 at the right angle
Implementation Method 2
the transmitted light is converted into an electric signal by the light-receiving unit 29
Data Source
AI summary
To provide a linear encoder including a scale unit and a slider that slides along the scale unit, wherein the slider includes a slider enclosure including a slider holding unit, a detection head holding unit mounted inside a scale enclosure of the scale unit, and a pillar extending between the outside and inside of the scale enclosure to connect these two holding units, and a part of the pillar closer to the detection head holding unit and a part of the detection head holding unit closer to the pillar are bored by a thickness larger than a thickness of the pillar.