Linear Motion Device Heat Transfer Body for Thermal Deformation

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing linear motion devices using linear motors face positioning accuracy issues due to thermal deformation caused by heat transfer from the mover to the moving body and guide rails, despite ventilation paths and heat insulating members, as heat is inevitably transferred through thermal radiation or convection.

Innovation Solution

A linear motion device design where the mover is positioned above the linear guide mechanism, with a heat transfer body extending away from the mechanism to dissipate heat efficiently, using materials with high thermal conductivity and incorporating spacers to create ventilation paths and prevent direct heat transfer, thereby reducing thermal deformation and improving positioning accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the mover is connected to the moving body for direct drive, then the moving body can be moved effectively, but heat generated from the mover is transferred to the moving body causing thermal deformation and deteriorating positioning accuracy

Engineering Contradiction:
Improvedrive forceVSAvoidpositioning accuracy
Core Design Contradiction:
PowerVSManufacturing precision

Solution Approach 1:

A heat transfer body is introduced as an intermediary between the mover and the moving body. This heat transfer body is connected to the mover and extends in a direction away from the linear guide mechanism, serving as a thermal conduit that directs heat away from the moving body while still enabling mechanical drive transmission.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The heat transfer body extends in a direction away from the linear guide mechanism (vertical dimension), separating the heat dissipation path from the horizontal motion path. This dimensional separation allows heat to be conducted away from the moving body without interfering with the precision positioning in the horizontal plane.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Temperature

If ventilation paths are provided between the mover and moving body, then heat transfer is reduced, but thermal radiation and convection still cause heat transfer to the moving body and guide rails

Engineering Contradiction:
Improveheat transfer reductionVSAvoidpositioning accuracy
Core Design Contradiction:
TemperatureVSManufacturing precision

Solution Approach 1:

The heat transfer body extracts heat from the mover by direct thermal conduction and redirects it away from the linear guide mechanism. By extending the heat transfer body in a direction away from the guide mechanism, the patent actively removes heat from the system before it can be transferred to the moving body or guide rails through radiation or convection.

Inventive Principle:
Principle #2Taking out (Extraction)

3Device complexity

If the mover is positioned close to the linear guide mechanism for compact design, then device size is reduced, but heat transfer to guide rails causes thermal deformation

Engineering Contradiction:
Improvecompact designVSAvoidguide rail thermal stability
Core Design Contradiction:
Device complexityVSStability of the object's composition

Solution Approach 1:

The heat transfer body acts as a thermal mediator between the mover and the environment, providing a dedicated heat dissipation path that prevents heat from being transferred to the guide rails. This allows the mover to be positioned close to the guide mechanism for compact design while maintaining guide rail thermal stability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration effectively prevents heat transfer from the mover to the moving body and guide rails, reducing thermal deformation and enhancing the positioning accuracy of the moving body by efficiently dissipating heat away from the linear guide mechanism.

Implementation Method 1

a heat transfer body that is disposed between the moving body and the mover and that is connected to the moving body and the mover, and the heat transfer body extends in a direction away from the linear guide mechanism

Methodology Applied
Scientific EffectHeat conduction: Conduction (thermal)

Implementation Method 2

providing a ventilation path through which cooling air flows between the mover and the moving body (top plate)

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS20230096476A1Linear motion device and electronic component mounting device
Publication Date: 2023.03.30 PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
  • US20230096476A1 patent drawing
  • US20230096476A1 patent drawing
  • US20230096476A1 patent drawing

AI summary

A linear motion device includes: a base that extends in a reference direction; a linear guide mechanism that includes a guide rail fixed to the base and extending in the reference direction and a slider supported movably on the guide rail along the reference direction; a moving body that is fixed to the slider and that is movable in the reference direction together with the slider; a linear motor that includes a stator fixed to the base, the stator including a magnet row and extending in the reference direction, and a mover including a plurality of coils provided with a certain gap from the stator; and a heat transfer body that is disposed between the moving body and the mover and that is connected to the moving body and the mover, and the heat transfer body extends in a direction away from the linear guide mechanism.