Linear-Parallel Cooling Channels for Electrostatic Chuck Temperature Uniformity
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Solution Overview
Problem
Typical electrostatic chuck (ESC) assemblies in semiconductor manufacturing tools lack uniform and rapid cooling for wafers due to their spiral cooling channel design, which results in temperature inconsistencies across the wafer support area.
Innovation Solution
The support pedestal device features a base housing with internal linear-parallel cooling channels and fins, allowing for efficient fluid flow through supply and return channels, directing the cooling fluid radially and bi-circumferentially to enhance thermal conductivity and reduce thermal mass, thereby improving temperature control across the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a spiral cooling channel design is used in the ESC assembly, then the cooling fluid can circulate through the chuck base, but the flow path becomes relatively long and temperature uniformity deteriorates
Solution Approach 1:
The patent divides the cooling channel into multiple straight parallel segments separated by cooling fins, replacing the single spiral channel. This segmentation creates multiple independent cooling paths that are shorter and more direct, improving both cooling efficiency and temperature uniformity across the wafer support surface.
Solution Approach 2:
The patent introduces cooling fins that extend vertically from the chuck base, creating a three-dimensional cooling structure. This adds a vertical dimension to the cooling architecture, increasing the cooling surface area and enabling more effective heat dissipation while maintaining compact horizontal dimensions.
2Productivity
If a spiral cooling channel is used, then the cooling fluid can be circulated, but the flow path length increases causing reduced cooling performance
Solution Approach 1:
The cooling system is segmented into multiple straight parallel channels instead of a single spiral path. Each channel provides a direct, short flow path from inlet to outlet, eliminating the long circumferential path of the spiral design and reducing total fluid travel distance while maintaining effective cooling coverage.
3Strength
If neighboring layers are bonded with thermally conductive elastomer adhesive, then the layers can be joined, but thermal resistance increases
Solution Approach 1:
The patent applies thermally conductive elastomer adhesive only at specific bonding interfaces between layers where mechanical strength is required, rather than throughout the entire cooling channel path. This localized application minimizes the introduction of thermal resistance while maintaining necessary structural bonds.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves a 30% increase in thermal transfer efficiency by maintaining a more uniform temperature and reducing thermal resistance, allowing for better responsiveness to heat loads with reduced back pressure and increased convection.
Implementation Method 1
A cooling fluid is able to flow through the fluid pathway by passing through the fluid supply channel, through the plurality of linear-parallel cooling channels, and back through the fluid return channel to cool the support pedestal device
Implementation Method 2
directing the cooling fluid through linear-parallel cooling channels; directing the cooing fluid inward radially through a fluid return channel to the central portion
Data Source
Figure 1
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Figure 4
AI summary
A support pedestal device for an electrostatic chuck includes a base housing defining an internal cavity, and a base insert disposed proximate the internal cavity of the base housing. A fluid pathway is formed in the internal cavity and includes a plurality of linear-parallel cooling channels separated by corresponding plurality of linear-parallel cooling fins, a fluid supply channel, and a fluid return channel. A cooling fluid flows through the fluid supply channel, through the plurality of linear- parallel cooling channels, and back through the fluid return channel to cool the support pedestal device.