Linear Pick-and-Place Device for Semiconductor Die Sorting
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Solution Overview
Problem
Traditional automated optical inspection systems for semiconductor dies face challenges such as independent and difficult-to-control driving apparatuses, large space requirements, slow operation speeds, and manual marking errors, which hinder efficient die sorting and packaging.
Innovation Solution
A system with a film frame platform and linear pick-and-place device, where the support table assembly and bins are integrally disposed on a platform, enabling simultaneous control and reducing space requirements, using a linear motion device for efficient die placement and automatic loading/unloading, and an optical sensing device for precise defect mapping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If independent driving apparatuses are used for wafer inspection platform and bin platform, then each platform can operate independently, but control difficulty increases and operational delays occur frequently
Solution Approach 1:
The patent merges the wafer inspection platform and bin platform onto a single integrated platform, eliminating the need for independent driving apparatuses. The pick-and-place device moves linearly between the support table and platform surface on the same base, reducing control complexity while maintaining operational capability through centralized control of the integrated system.
Solution Approach 2:
The integrated platform serves multiple functions: supporting the wafer during inspection, providing a surface for bin placement, and enabling linear motion of the pick-and-place device. This multi-functional design eliminates the need for separate driving systems while maintaining the system's operational versatility.
2Productivity
If swing arm mechanism is used for pick-and-place operation, then die sorting can be performed, but space requirement increases and operation speed decreases
Solution Approach 1:
The patent replaces the traditional swing arm mechanism with a linear motion system. The pick-and-place device moves in a straight line between the support table and platform surface using linear guides and drive mechanisms, eliminating the arc-shaped motion path of swing arms. This substitution increases operation speed by reducing travel distance and eliminates the space requirements for swing arm rotation arcs.
3Ease of operation
If traditional swing arm mechanism is used, then die picking and placing can be performed, but space requirement increases due to movement path
Solution Approach 1:
The patent transitions from the two-dimensional arc-shaped motion path of swing arms to a one-dimensional linear motion path. The pick-and-place device moves along a straight line perpendicular to the platform surface, utilizing vertical and linear horizontal movement instead of rotational arc movement. This dimensional change reduces the horizontal space footprint while maintaining the die picking and placing capability.
4Loss of information
If manual marking is used for defective die locations on wafer map, then defect tracking can be performed, but efficiency decreases and errors increase
Solution Approach 1:
The patent replaces manual marking with an automated optical inspection and marking system. Optical sensors detect defective dies during inspection, and the system automatically marks their locations on the wafer map using coordinate data. This substitution eliminates manual intervention, increasing efficiency while improving accuracy through automated detection and marking capabilities.
5Adaptability or versatility
If independent platforms are used for wafer inspection and bin placement, then flexibility is maintained, but system stability decreases
Solution Approach 1:
The patent combines the wafer inspection platform and bin platform into a single integrated platform structure. This integration provides a stable, unified base that eliminates relative motion and alignment issues between separate platforms. The integrated design maintains flexibility through the movable pick-and-place device while improving stability by eliminating the instability inherent in coordinating multiple independent platforms.
Data Source
AI summary
A system separating defective dies from a wafer comprises a film frame platform and a pick-and-place device. The film frame platform comprises a support table assembly configured for supporting a film frame assembly and a platform surface configured to receive the placement of bins thereupon. The pick-and-place device is configured for moving in a linear manner between the support table assembly and the platform surface.