Linear Plasma PECVD for Uniform Double-Sided Substrate Coating
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Solution Overview
Problem
Existing plasma enhanced chemical vapour deposition (PECVD) methods face challenges in uniformly coating both sides of a substrate without causing thermal stress, warping, or delamination, and require large reactor volumes and complex cooling systems.
Innovation Solution
A process using a plurality of linear plasma sources for simultaneous deposition on both sides of a substrate, combined with radiative cooling, eliminates the need for cooling rollers and reduces reactor volume, ensuring uniform coating and minimizing thermal stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If sequential deposition onto two sides of a substrate is used, then both sides can be coated, but the substrate must be cooled between depositions causing thermal stress, warping, and delamination
Solution Approach 1:
The patent combines two deposition operations into a single simultaneous process by positioning two linear plasma sources on opposite sides of the substrate, allowing both sides to be coated at the same time without intermediate cooling steps that cause thermal stress and warping
2Temperature
If a cooling roller is used between depositions, then the substrate can be cooled, but the system complexity and reactor volume increase
Solution Approach 1:
The patent removes the cooling roller component entirely from the system by adopting simultaneous deposition, eliminating the need for mechanical cooling infrastructure and associated complexity while maintaining temperature control through the physics of the deposition process itself
3Manufacturing precision
If sequential deposition with cooling roller is used, then both sides can be coated, but energy consumption increases due to repeated heating and cooling
Solution Approach 1:
The patent merges two separate heating cycles into one simultaneous heating event, where both sides of the substrate are heated and coated at the same time, eliminating the repeated thermal cycling that wastes energy in sequential processes
4Ease of operation
If vacuum ports are used for substrate passage, then substrate can be transported, but deposition uniformity degrades due to physical contact
Solution Approach 1:
The patent removes vacuum ports from the deposition chamber by implementing a design where substrates are transported through the plasma field without physical contact points, eliminating contamination sources that would degrade deposition uniformity while maintaining ease of substrate handling
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves uniform deposition on both sides of a substrate without thermal stress, reduces energy consumption, and simplifies the manufacturing process by eliminating the need for cooling rollers and vacuum ports.
Implementation Method 1
The plasma is typically generated by microwave radiation, or by radio frequency (RF) or direct current (DC) discharge between two electrodes
Implementation Method 2
The plasma source extends along an axis that extends along the axis of the rod shaped antenna with a defined length
Implementation Method 3
radiatively cooling the substrate between the first deposition zone and the second deposition zone
Implementation Method 4
The deposition process involves chemical reactions which occur after introductions of the feedstock gasses to the plasma
Implementation Method 5
high plasma density can be achieved
Data Source
AI summary
The present disclosure relates to a process for simultaneous deposition onto two opposite sides of a sheetlike substrate using a plurality of linear plasma sources, comprising the steps: providing a reaction chamber comprising a gaseous atmosphere; and at least two linear plasma sources positioned in the chamber,introducing a sheetlike substrate comprising two elongate sides into the reaction chamber, and moving the substrate between the at least two linear plasma sources at a first velocity; supplying power to the linear plasma sources to generate linear plasmas in the vicinity of each side of the substrate;introducing at least one reactant mixture, at a first gas flow rate, into the reaction chamber on each of the respective opposite sides of the substrate, the composition of the mixture being such that, upon contact with the plasma, the reactant mixture decomposes and generates a chemical reactant species capable of being deposited as a film onto the corresponding side of the substrate;allowing the chemical reactant species to simultaneously be deposited onto the first and second opposite sides of the substrate at the same position with respect to the substrate movement direction;to obtain a substrate comprising a coated homogeneous film of desired thickness on the opposite sides of the substrate.