Linear Reactor Layout for Multi-Step Semiconductor Processing

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Solution Overview

Problem

The semiconductor manufacturing process requires numerous specialized reactors for each fabrication step, leading to high costs and spatial requirements due to the need for precise control of environmental conditions, which current technologies fail to efficiently consolidate.

Innovation Solution

A linear reactor framework that integrates multiple processing steps into a single reactor, allowing for uniform fluid flow and modular components to manage chemical reactions across a wide range of conditions, reducing the need for multiple reactors.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If multiple specialized reactors are used for each fabrication step, then manufacturing precision is maintained, but device complexity and cost increase

Engineering Contradiction:
Improvefabrication precisionVSAvoidreactor quantity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The linear reactor is designed as a universal platform that can perform multiple semiconductor fabrication functions including CVD, PVD, etching, and annealing within a single reactor system, eliminating the need for multiple specialized reactors while maintaining process precision through modular process modules

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The reactor system is divided into modular process modules that can be selectively activated for different fabrication steps, allowing each function to be independently optimized while sharing common infrastructure such as the chamber, fluid management, and control systems

Inventive Principle:
Principle #1Segmentation

2Manufacturing precision

If multiple specialized reactors are used for each fabrication step, then manufacturing precision is maintained, but loss of substance and cost increase

Engineering Contradiction:
Improvefabrication precisionVSAvoidmaterial cost
Core Design Contradiction:
Manufacturing precisionVSLoss of substance

Solution Approach 1:

Multiple fabrication processes are merged into a single linear reactor chamber, allowing sequential processing of substrates through different process zones. This consolidation reduces the total amount of processing materials needed compared to multiple separate reactors, while maintaining precision through controlled fluid delivery to each process zone

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The system enables recovery and reuse of processing fluids and materials through the linear flow path, where exhaust from one process zone can be conditioned and reused in subsequent zones, reducing overall material consumption and cost

Inventive Principle:
Principle #34Discarding and recovering

3Manufacturing precision

If multiple specialized reactors are used for each fabrication step, then manufacturing precision is maintained, but the area occupied increases

Engineering Contradiction:
Improvefabrication precisionVSAvoidreactor footprint
Core Design Contradiction:
Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The system transitions from a vertical stacking arrangement of multiple reactors to a horizontal linear arrangement, extending the processing path in the longitudinal dimension while reducing the vertical and lateral footprint. This linear configuration allows multiple process zones to be arranged sequentially along the flow path

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Device complexity

If a single reactor is used for multiple processing steps, then device complexity is reduced, but manufacturing precision may be compromised

Engineering Contradiction:
Improvereactor quantityVSAvoidfabrication precision
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The reactor system incorporates dynamic control mechanisms including adjustable flow rates, temperature zones, and process parameters that can be independently optimized for each fabrication step. This dynamic adaptability allows a single reactor to maintain precision across multiple different processes

Inventive Principle:
Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces the number of reactors needed, lowers costs, and optimizes spatial requirements while maintaining precise control over environmental conditions, enhancing efficiency and reducing defect management.

Implementation Method 1

The system is configured to fabricate electronic circuits onto the substrate by passing fluid over the substrate from the first hydraulic device to the second hydraulic device

Methodology Applied
Scientific EffectFluid flow:

Implementation Method 2

The first piston may be configured to draw the fluid from the external fluid source into the first hydraulic volume and upon closing of the first isolation valve and opening of the first gate load lock, induce a flow of the fluid into the reaction chamber

Methodology Applied
Scientific EffectPressure differential: Pressure Gradient

Data Source

PatentUS20250210377A1Linear reactor for substrate processing
Publication Date: 2025.06.26 HOERNER MITCH
  • US20250210377A1 patent drawing
  • US20250210377A1 patent drawing
  • US20250210377A1 patent drawing

AI summary

A linear reactor that is capable of performing many of the semiconductor substrate processing steps in order to manufacture an integrated circuit. The linear reactor permits a number of different processing steps to take place within the reactor in the manufacture of an integrated circuit. Thus, single reactor furnaces can be used for most, and potentially all, semiconductor processing steps of an integrated circuit. The linear reactor has a chamber that extends linearly from a first end to a second end and gases flow from the first end into the second end during the semiconductor processing steps. The chamber is bounded by a top wall and the bottom wall with a space in between that provides the chamber in which the semiconductor processing steps are carried out.