Linear Robot Shuttle Wafer Transfer System
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Solution Overview
Problem
The increasing complexity of semiconductor device fabrication requires more processing steps and chambers, leading to longer process times and the need for additional configurations in processing tools, which is complicated and time-consuming to design and qualify.
Innovation Solution
A semiconductor processing system featuring a linear robot and cluster robots that allow for flexible and scalable wafer transfer between multiple processing chambers, enabling independent movement of wafers and accommodating future expansions without requiring new equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If additional processing chambers are added to accommodate pre-processing and post-processing requirements, then the system's adaptability and versatility improve, but the device complexity and design qualification time increase
Solution Approach 1:
The linear robot system with multiple shuttles serves multiple functions: it can transfer wafers between different processing chambers, store wafers in intermediate positions, and accommodate various processing sequences. This multi-functional design allows the same hardware infrastructure to support pre-processing, main processing, and post-processing operations without requiring separate dedicated equipment for each function.
Solution Approach 2:
The wafer transfer system is divided into multiple independent shuttles (first shuttle, second shuttle) that can operate independently on the same linear bearing. This segmentation allows parallel operations where different wafers can be moved simultaneously between different chambers, increasing system versatility without proportionally increasing overall system complexity.
2Productivity
If more processing chambers are added to maintain throughput, then the productivity improves, but the device complexity and design time increase
Solution Approach 1:
The linear robot system enables continuous wafer transfer operations by having multiple shuttles that can operate in sequence or parallel. While one shuttle is transferring a wafer, another shuttle can simultaneously transfer a different wafer, ensuring that the processing line operates continuously without idle time, thereby maintaining high throughput.
Solution Approach 2:
The system adds a temporal dimension to wafer processing by implementing multi-shuttle operations that can execute transfer tasks at different times. This allows the system to handle multiple wafers through the processing line simultaneously by staggering their transfer times, effectively increasing throughput without adding proportional physical complexity.
3Adaptability or versatility
If independent shuttle movement is implemented, then the system's flexibility and adaptability improve, but the control complexity increases
Solution Approach 1:
The shuttles are designed with independent movement capability along the linear bearing, allowing their positions and movement timing to be dynamically adjusted based on processing requirements. This dynamic configuration enables the system to adapt to different processing sequences and chamber configurations without requiring physical reconfiguration of the hardware.
Data Source
AI summary
A system including a first linear bearing, a second linear bearing, a first shuttle, and a second shuttle. The first linear bearing is mounted in and disposed along a linear path of a transfer chamber. The second linear bearing is mounted on a same side of the transfer chamber as the first linear bearing and disposed along the linear path. The first shuttle rides on the first linear bearing and carries a first wafer. The second shuttle rides on the second linear bearing and carries a second wafer. The second shuttle moves independent of the first shuttle. During movement of the first shuttle and the second shuttle and during a first period of time, a first portion of the second shuttle is above the first shuttle such that the first portion of the second shuttle is vertically overlapping the first shuttle. During movement of the first shuttle and the second shuttle and during a second period of time, the first portion of the second shuttle is not above the first shuttle such that the first portion of the second shuttle is not vertically overlapping the first shuttle.