Linear Image Sensor Chip Arrangement and Sealing
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing linear image sensors face challenges in precisely arranging multiple sensor chips in tandem and achieving a flat sealing surface, which affects the optical characteristics.
Innovation Solution
A linear image sensor configuration where sensor chips are mounted on substrates that partially protrude, with a common support substrate and support portions to align them precisely, and a sealing portion is formed around the chips using a resin to ensure flatness and optical quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If multiple sensor chips are disposed in tandem to achieve overall long linear image sensor, then the sensor length is increased, but the arrangement precision of sensor chips deteriorates
Solution Approach 1:
The linear image sensor is divided into multiple sensor chips (first sensor chip, second sensor chip, etc.) that are disposed in tandem. Each sensor chip is mounted on a separate substrate (first substrate, second substrate), allowing independent manufacturing and positioning. This segmentation enables the overall sensor to achieve greater length while maintaining precision through modular assembly on a common support substrate.
2Length of moving object
If multiple sensor chips are disposed in tandem to achieve overall long linear image sensor, then the sensor length is increased, but the flatness of sealing portion surface deteriorates
Solution Approach 1:
A common support substrate serves as an intermediary platform that supports multiple substrates (first substrate, second substrate, etc.) in a predetermined arrangement. This intermediary structure provides a stable reference plane that ensures the sealing portions of multiple sensor chips align flatly, even when the overall sensor length is extended through tandem configuration of multiple chips.
3Manufacturing precision
If sensor chips are mounted with protrusion to facilitate arrangement, then the arrangement precision is improved, but the device complexity increases
Solution Approach 1:
Each sensor chip is mounted asymmetrically on its substrate such that it protrudes from one end of the substrate. This asymmetric protrusion design creates a natural positioning feature that simplifies the arrangement process, as the protruding portions can be easily aligned and positioned on the common support substrate without requiring complex positioning mechanisms.
Data Source
AI summary
A linear image sensor includes first and second sensor chips, first and second substrates, a common support substrate, a support portion, a dam portion, and a sealing portion. The first sensor chip is mounted to partially protrude on one end side of the first substrate. The second sensor chip is mounted to partially protrude on one end side of the second substrate. The first and second substrates are mounted on the common support substrate. The support portion is provided in a gap between the end faces of the first and second substrates. The dam portion is provided annularly to surround the sensor chips. The sealing portion seals the sensor chips, in a region surrounded by the dam portion.