Linear Substrate Treating Apparatus with Buffer for Footprint Reduction

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Solution Overview

Problem

The existing substrate treating apparatus has limitations in throughput and footprint due to its stacked treatment layer configuration, which reduces the number of treatable layers and increases the height, leading to inefficiencies in substrate transportation and control.

Innovation Solution

A substrate treating apparatus with a linear configuration of indexer, first, and second treating blocks, where the indexer block transports substrates between a carrier and substrate buffers, and the treating blocks perform treatments without stacking, allowing for increased treatment layers and reduced footprint by using substrate buffers and carrier storage shelves strategically.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If treatment layers are stacked vertically to increase parallel treatment capacity, then productivity increases, but the apparatus height increases and footprint is reduced

Engineering Contradiction:
Improveparallel treatment capacityVSAvoidapparatus height
Core Design Contradiction:
ProductivityVSLength of stationary object

Solution Approach 1:

The patent transitions from vertical stacking to horizontal linear arrangement of treatment layers, changing the spatial dimension from vertical (Z-axis) to horizontal (X-axis). This allows multiple treatment layers to be arranged in sequence along the horizontal direction, increasing apparatus length while maintaining manageable height and enabling parallel processing capabilities.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The apparatus is divided into independent treatment layers (first treating block and second treating block) that can be separately controlled and operated. Each treatment layer functions as an independent module with its own substrate buffer and treatment chamber, allowing parallel operation and flexible configuration without requiring vertical stacking.

Inventive Principle:
Principle #1Segmentation

2Length of stationary object

If treatment layers are arranged horizontally in sequence, then apparatus height is reduced and footprint is decreased, but substrate transportation complexity increases

Engineering Contradiction:
Improveapparatus heightVSAvoidsubstrate transportation control
Core Design Contradiction:
Length of stationary objectVSDevice complexity

Solution Approach 1:

A substrate buffer is introduced as an intermediary component between the indexer block and each treatment layer. This buffer acts as a temporary storage and transfer station, simplifying the transportation control by providing a standardized interface for substrate exchange between blocks, thereby reducing the complexity of direct point-to-point transportation control.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The linear horizontal arrangement allows substrates to move continuously through the treatment layers in sequence without requiring complex vertical lifting and positioning mechanisms. The substrate transportation follows a continuous horizontal path from the indexer block through the first and second treating blocks, maintaining steady workflow and reducing control complexity.

Inventive Principle:
Principle #20Continuity of useful action

3Productivity

If more treatment layers are added to increase productivity, then output increases, but the apparatus footprint and height increase

Engineering Contradiction:
Improvetreatment layer quantityVSAvoidapparatus footprint
Core Design Contradiction:
ProductivityVSArea of stationary object

Solution Approach 1:

Instead of expanding the apparatus vertically or increasing footprint area, the patent arranges treatment layers horizontally in a linear sequence along the X-axis. This dimensional reorganization allows multiple treatment layers to be accommodated within a compact footprint by utilizing the horizontal length of the apparatus, thereby increasing productivity without proportionally increasing the apparatus footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Productivity

If substrate buffers are positioned between indexer and treating blocks, then substrate exchange efficiency improves, but apparatus complexity increases

Engineering Contradiction:
Improvesubstrate exchange efficiencyVSAvoidbuffer positioning mechanism
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The substrate buffer is merged with the indexer block and treating blocks as an integrated component rather than a separate independent unit. The buffer shares the same structural framework and control system with the adjacent blocks, allowing substrate exchange to occur through coordinated movement within the same horizontal plane, thereby improving efficiency without significantly increasing overall apparatus complexity.

Inventive Principle:
Principle #5Merging (Combining)

Data Source

PatentUS11348812B2Substrate treating apparatus and substrate transporting method
Publication Date: 2022.05.31 SCREEN HOLDINGS CO LTD
  • US11348812B2 patent drawing
  • US11348812B2 patent drawing
  • US11348812B2 patent drawing

AI summary

Disclosed are a substrate treating apparatus and a substrate transporting method for the substrate treating apparatus. Two treating blocks are arranged so as not to be stacked, and a first treating block, an ID block, and a second treating block are linearly connected horizontally. Accordingly, the number of treatment layers is increasable while a height of the substrate treating apparatus is suppressed. The first and second treating blocks are each connected to the ID block directly. This enables suppression in step of passing a substrate through a treating block without performing any treatment on the substrate, leading to prevention of decrease in throughput. In addition, a substrate buffer is placed in the middle of the two treating blocks. The two treating blocks enable transportation of substrates W with the substrate buffer. Thus, reduction in footprint of the substrate treating apparatus is obtainable.