Linear Substrate Transport Platform for Compact Vacuum Handling
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Solution Overview
Problem
Existing substrate processing systems for semiconductor and LED applications require large radial transport chambers to accommodate multiple process modules, leading to a significant footprint and increased costs in micro-electronics fabrication environments.
Innovation Solution
A substrate transport platform with a linear configuration, featuring a robot drive, an arm with multiple links, and end effectors, which allows for efficient movement of substrates between load locks and opposing process modules, reducing the overall footprint.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If radial transport chamber with multiple process modules is used, then substrate processing capability is improved, but footprint area increases significantly
Solution Approach 1:
The patent transitions from a radial arrangement (2D plane) to a linear arrangement (1D line), fundamentally changing the spatial organization of process modules. This dimensional change allows modules to be arranged in a straight line between load locks, dramatically reducing the footprint area while maintaining the ability to process multiple substrates through sequential or parallel operations along the linear path.
Solution Approach 2:
The linear transport chamber is divided into multiple discrete process modules arranged sequentially. Each module can be independently accessed by the robot, allowing for modular substrate processing. This segmentation enables high productivity through parallel or sequential operations while keeping the overall footprint compact compared to a radial configuration.
2Adaptability or versatility
If large radial transport chamber is used to accommodate multiple process modules, then substrate transport flexibility is improved, but cost increases due to premium footprint
Solution Approach 1:
By reorganizing the transport chamber from radial to linear configuration, the patent reduces the spatial footprint while maintaining transport flexibility through the linear arrangement of modules. This dimensional optimization directly reduces construction and facility costs associated with large footprint requirements.
Solution Approach 2:
The linear transport chamber design with multiple process modules allows a single system to handle various substrate processing operations through different module combinations. The robot can selectively access and operate with different modules, providing versatile substrate transport and processing capabilities within a compact, cost-effective footprint.
3Measurement precision
If robot arm with multiple links is used, then end effector reach and positioning precision are improved, but device complexity increases
Solution Approach 1:
The robot arm employs multiple dynamically articulated links that can move and position the end effector with high precision throughout the linear transport chamber. This dynamic multi-link structure allows the robot to reach all process modules while maintaining precise positioning control, enabling accurate substrate manipulation despite the increased mechanical complexity of the articulated arm.
Data Source
AI summary
A transport apparatus including a robot drive; an arm having a first end connected to the robot drive; and at least one end effector connected to a second end of the arm. The arm includes at least three links connected in series to form the arm. The arm is configured to be moved by the robot drive to move the at least one end effector among load locks and two or more sets of opposing process modules.