Linear Wafer Expander Layout for Simpler Chip Separation

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Solution Overview

Problem

Existing expanding devices for dividing wafers into semiconductor chips have complex movement mechanisms due to the inclusion of a squeegee unit, which complicates the structure for supplying wafers between devices like the expander and squeegee unit.

Innovation Solution

An expanding device with an expander, cooler, heater, and squeegee unit aligned linearly in a plan view, using a single movement mechanism to supply wafers, thereby simplifying the movement mechanism structure and reducing device size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a squeegee unit is added to divide undivided wafer portions after expansion, then the completeness of wafer division is improved, but the movement mechanism structure becomes complex

Engineering Contradiction:
Improvecompleteness of wafer divisionVSAvoidmovement mechanism structure
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The squeegee unit is integrated into the expander assembly, sharing the same linear movement mechanism. The squeegee unit and expander are positioned at different heights but aligned linearly, allowing a single movement mechanism to control both components for wafer expansion and undivided portion separation.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The squeegee unit is arranged in a vertical dimension relative to the expander, with both components aligned linearly along the movement direction. This spatial arrangement allows the same linear movement mechanism to drive both units without requiring additional complex positioning systems.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Device complexity

If multiple devices (expander, cooler, heater, squeegee unit) are supplied by a single linear movement mechanism, then the movement mechanism structure is simplified, but the device size may increase

Engineering Contradiction:
Improvemovement mechanism structureVSAvoiddevice size
Core Design Contradiction:
Device complexityVSVolume of moving object

Solution Approach 1:

Multiple processing units (squeegee unit, expander, cooler, heater) are arranged linearly in the horizontal direction and positioned at different vertical heights. This three-dimensional layout allows a single linear movement mechanism to access all units without requiring excessive horizontal space, effectively managing device footprint.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

A single linear movement mechanism serves multiple functions by controlling the squeegee unit, expander, cooler, and heater. This multi-functional approach simplifies the overall movement mechanism structure while the vertical stacking arrangement optimizes space utilization.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The linear alignment of devices allows for a simplified movement mechanism that reduces the size and complexity of the expanding device, enabling efficient wafer division into semiconductor chips.

Implementation Method 1

at least one of a cooler to cool the sheet member before the sheet member is expanded by the expander

Methodology Applied
Scientific EffectCooling: Cooling

Implementation Method 2

a heater to heat and shrink the sheet member expanded by the expander while maintaining a gap between the plurality of semiconductor chips

Methodology Applied
Scientific EffectHeating: Heating

Implementation Method 3

an expander to expand an elastic sheet member to divide a wafer into a plurality of semiconductor chips along a dividing line

Methodology Applied
Scientific EffectElastic expansion: Elasticity

Data Source

PatentUS20250218871A1Expanding device, semiconductor chip manufacturing method, and semiconductor chip
Publication Date: 2025.07.03 YAMAHA MOTOR CO LTD
  • US20250218871A1 patent drawing
  • US20250218871A1 patent drawing
  • US20250218871A1 patent drawing

AI summary

An expanding device includes an expander, a cooler, a squeegee unit, and a movement mechanism. The expander, at least one of the cooler or a heater, and the squeegee unit are linearly aligned in a plan view.