Lining Ring Assembly Flow Uniformizing Cavity Gas Distribution
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Solution Overview
Problem
In conventional semiconductor process chambers, the diffusion of processing gas into the reaction chamber is slow, leading to non-uniform gas distribution and control issues, which affect the uniformity and efficiency of the deposition process.
Innovation Solution
A process chamber design featuring a lining ring assembly with a flow uniformizing cavity between the lining ring assembly and the inner side wall of the reaction compartment, which facilitates uniform gas distribution through radial through holes, enhancing gas flow speed and control within the reaction chamber.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If processing gas is provided into the reaction chamber through conventional diffusion, then the gas distribution is simple and structure is simple, but the gas flow speed is slow and gas distribution uniformity is poor
Solution Approach 1:
The reaction chamber is segmented into multiple gas distribution zones through the lining ring assembly with multiple gas inlet holes. This segmentation allows processing gas to be introduced at multiple locations simultaneously, increasing overall gas flow speed while maintaining a relatively simple overall chamber structure.
Solution Approach 2:
The lining ring assembly acts as an intermediary component between the gas supply system and the reaction chamber. It features a flow uniformizing cavity with radially distributed inlet holes that mediate gas flow distribution, enhancing gas flow speed and uniformity without requiring complex internal chamber structures.
2Stability of the object's composition
If processing gas is provided into the reaction chamber through conventional diffusion, then the chamber structure is simple, but the gas distribution uniformity is poor
Solution Approach 1:
The lining ring assembly implements local quality by providing gas introduction at multiple specific locations around the reaction chamber perimeter. The multiple gas inlet holes are strategically positioned to create locally uniform gas distribution zones that collectively achieve overall uniform gas distribution in the reaction chamber.
Solution Approach 2:
The gas distribution transitions from a single-point or single-line introduction to a multi-dimensional distribution pattern. The lining ring assembly distributes gas radially across the chamber perimeter, adding a circumferential dimension to gas introduction and significantly improving distribution uniformity.
3Measurement precision
If processing gas is provided into the reaction chamber through conventional diffusion, then the structure is simple, but the control accuracy over gas flow is poor
Solution Approach 1:
The flow uniformizing cavity within the lining ring assembly serves as an intermediary control element. It features multiple radially distributed gas inlet holes that provide precise control over gas flow distribution. This intermediary structure enables accurate control of gas flow into the reaction chamber while maintaining a relatively simple overall gas introduction system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the speed and uniformity of processing gas distribution, ensuring more accurate control over the gas flow and enhancing the uniformity and efficiency of the semiconductor processing results.
Implementation Method 1
a flow uniformizing cavity is formed between the lining ring assembly and an inner side wall of the reaction compartment, so as to uniformly transport the processing gas from the gas introducing system into the reaction compartment through the flow uniformizing cavity
Data Source
AI summary
Embodiments of the invention provide a process chamber and a semiconductor processing apparatus. According to at least one embodiment, the process chamber includes a reaction compartment, a gas introducing system and a wafer transfer device. The reaction compartment is provided in the process chamber and used for performing a process on a wafer, the gas introducing system is used for providing processing gas to the reaction compartment, and the wafer transfer device is used for transferring the wafer into the reaction compartment. A lining ring assembly is provided in the reaction compartment, and is configured such that a flow uniformizing cavity is formed between the lining ring assembly itself and an inner side wall of the reaction compartment, so as to uniformly transport the processing gas, from the gas introducing system, into the reaction compartment through the flow uniformizing cavity.