Link-Arm Wafer Box Transfer for Vibration-Stable Stocking
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Solution Overview
Problem
Existing semiconductor transfer systems face challenges in securely and efficiently transferring wafer stacking boxes between process equipment and stockers, often resulting in vibration and potential damage to the wafers during movement.
Innovation Solution
A transfer apparatus with link arms and a stocker system that includes a lower and upper plate with pivotable link arms and a fixing member with contact pads, allowing for linear movement and secure contact with the wafer stacking box to prevent shaking and vibration during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional transfer system is used to move wafer stacking boxes, then the transfer process can be completed, but vibration and shaking occur during movement causing potential damage to wafers
Solution Approach 1:
The patent applies dynamics by making the link arms pivotable rather than fixed, allowing the transfer apparatus to adapt its configuration during movement. The link arms can rotate at connection points between the upper and lower plates, enabling dynamic adjustment that absorbs vibrations and maintains stable contact with the wafer stacking box throughout the transfer process
Solution Approach 2:
The transfer apparatus is segmented into multiple components: an upper plate, a lower plate, and intermediate link arms with multiple connection points. This segmentation allows each component to move and adjust independently, with the link arms acting as flexible connectors that can pivot to reduce shock and vibration transmission to the wafer stacking box
2Adaptability or versatility
If the upper plate is rigidly fixed to the lower plate, then structural stability is achieved, but the system cannot adapt to movements and vibrations during transfer
Solution Approach 1:
The connection between upper and lower plates is made dynamic through pivotable link arms with rotation joints. These link arms can change their angular position during transfer operations, allowing the upper plate to maintain proper alignment while adapting to movements and vibrations, thus achieving both stability and adaptability simultaneously
Data Source
AI summary
A transfer apparatus includes a lower plate including a lower link arm and a lower support, the lower support being fixed to an upper surface of the lower plate, an upper plate on the lower plate and configured to support a wafer stacking box on an upper surface of the upper plate, the upper plate including an upper link arm, and an upper support that is fixed to the upper surface of the upper plate, and a fixing member that is connected to the upper link arm, the fixing member configured to selectively contact the wafer stacking box. The upper plate is aligned with the lower plate in a first horizontal direction, and is configured to perform linear movement on the lower plate in the first horizontal direction.