Link Chamber Interface for Semiconductor Substrate Transfer
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Solution Overview
Problem
The existing methods for transporting semiconductor substrates between processing locations within a fabrication facility often expose them to undesirable environments, such as oxidizing species and contaminants, as they are typically moved through non-vacuum conditions.
Innovation Solution
A linked processing system with a link chamber and transfer vias connected to processing tools, utilizing a link robot to transfer substrates within higher vacuum regions, minimizing contamination and optimizing floor space usage by positioning the link tools at the backend of processing tools.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If substrates are transported using conventional substrate carriers and automated transport devices, then substrate transport between processing locations can be achieved, but substrates are exposed to undesirable environments such as oxidizing species and contaminants
Solution Approach 1:
A link tool serving as an intermediary device is introduced between processing tools. This link tool includes a link chamber with transfer vias that connect to processing tools, and a link robot that transfers substrates within the link chamber. The link tool acts as a mediator that enables substrate transfer while maintaining vacuum conditions, preventing exposure to contaminants present in conventional transport systems.
Solution Approach 2:
The link chamber is maintained at high vacuum conditions, creating an inert environment that prevents oxidation and contamination of substrates during transfer. This vacuum environment isolates substrates from harmful atmospheric species, allowing clean transport between processing locations without exposure to contaminants.
2Area of stationary object
If link tools are positioned at the backend of processing tools, then floor space utilization is optimized, but system complexity increases
Solution Approach 1:
The link tool is positioned at the backend of processing tools, utilizing vertical or lateral space rather than horizontal floor space. This dimensional repositioning allows the link chamber to connect to processing tools via transfer vias, optimizing floor space utilization while maintaining functional connectivity through a different spatial arrangement.
3Adaptability or versatility
If substrates are transferred through non-vacuum conditions, then transport flexibility is improved, but substrate integrity deteriorates due to contamination
Solution Approach 1:
The link chamber maintains high vacuum conditions throughout the substrate transfer process, creating a protected inert environment that preserves substrate integrity. This vacuum environment prevents exposure to oxidizing species and contaminants, ensuring substrate reliability while still allowing flexible transfer between different processing locations through the link robot and transfer vias.
Data Source
AI summary
Embodiments described herein provide for link tools and linked processing systems having two or more processing tools connected by one or more link tools. Each arrangement of the link processing system includes adjacent processing tools coupled to a link chamber at the transfer modules at the backend of the processing tools. The backend coupling utilizes of floor space away from the factory interfaces of the processing tools. The link chambers have at least five facets. The system further includes two or more transfer vias. Each transfer via is coupled to a facet of the link chamber. The transfer vias are connectable to transfer modules of processing tools. The system further includes a link robot disposed in the link chamber operable to transfer one or more substrates between the transfer vias connectable to the transfer modules of the processing tools.