Linkage Fan Blade Structure for Flip-Type Device Heat Dissipation
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Solution Overview
Problem
The existing heat dissipation hole structures in portable electronic devices, such as notebook computers, have unsatisfactory heat dissipation efficiency due to structural constraints that limit the opening rate, preventing effective heat removal from electronic elements.
Innovation Solution
A linkage fan blade structure is designed for flip-type electronic devices, featuring a mechanism with first and second connecting rods and blade groups that pivotally rotate to create inclined positions, increasing the number of heat dissipation holes and forming triangular openings for enhanced heat dissipation under the same area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation holes are made larger to improve heat dissipation effect, then heat dissipation efficiency is improved, but safety regulation standards are violated and structural strength is compromised
Solution Approach 1:
The heat dissipation structure is segmented into multiple blade groups with individual blades that can be independently arranged. Each blade contains heat dissipation holes, and the segmented blade configuration allows multiple small openings to collectively provide effective heat dissipation while maintaining structural integrity and complying with safety regulations regarding individual hole dimensions
Solution Approach 2:
The blade groups are arranged in a specific dimensional configuration relative to the heat dissipation opening, creating multiple heat dissipation pathways in different spatial orientations. This dimensional arrangement increases the total heat dissipation area without requiring individual holes to exceed safety limits, as the collective effect of multiple smaller openings achieves the desired thermal performance
2Temperature
If the opening rate of heat dissipation holes is increased to improve heat dissipation, then heat dissipation effect is improved, but the structural strength of the heat dissipation area is reduced
Solution Approach 1:
The heat dissipation function is segmented across multiple blades and blade groups rather than concentrated in a single large opening. This segmentation allows the heat dissipation area to be distributed throughout the structure, maintaining structural strength while achieving high overall opening rate for effective heat dissipation
Solution Approach 2:
Different regions of the blade structure have different properties: the blades contain heat dissipation holes for thermal performance, while the blade groups and connecting structures maintain structural integrity. This local differentiation of quality allows simultaneous optimization of both heat dissipation effectiveness and structural strength in different parts of the system
Data Source
AI summary
The present disclosure relates to a heat dissipation hole structure of a flip-type electronic device. The heat dissipation hole structure includes a first connecting rod, a second connecting rod, and a blade group. The flip-type electronic device includes a base, an upper cover, and a pivot. Two ends of the first connecting rod are respectively pivoted to the pivot and the second connecting rod. The second connecting rod is further pivoted to the blade group. The blade group is disposed in an opening of the base and includes two blades. The two blades are both pivoted to an inner surface of the opening, and one end of each of the two blades is slidably connected to each other. In this way, when the upper cover is opened, the pivot drives the blade group through the first connecting rod and the second connecting rod, so that the two blades rotate.