Linked Semiconductor Module Unit Resin Embedded Bus Bar
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Solution Overview
Problem
Conventional electric motor devices rely on printed circuit boards for mounting semiconductor modules, which can be cumbersome and inefficient, especially in compact designs like electric power assist systems where space and heat dissipation are critical.
Innovation Solution
A linked semiconductor module unit is created without using a printed circuit board, where semiconductor modules are linked by a conductive bus bar embedded in resin, allowing for flexible placement and improved heat dissipation, and the bus bars are designed to be bent for optimal positioning.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If semiconductor modules are mounted on a printed circuit board, then electrical connectivity is achieved, but the physical size and complexity of the motor device increases
Solution Approach 1:
The patent merges the linking function and electrical connectivity function into a single integrated structure. The resin part encapsulates both the semiconductor modules and the bus bars, eliminating the need for separate mounting hardware and reducing overall device complexity while minimizing physical size.
Solution Approach 2:
The patent extracts the printed circuit board from the mounting structure and replaces it with direct resin encapsulation. This removal of the PCB simplifies the overall structure, reduces physical size, and eliminates unnecessary intermediate layers while maintaining all required electrical connections through the bus bars embedded in the resin.
2Temperature
If a printed circuit board is used for mounting, then electrical connectivity is provided, but heat dissipation efficiency deteriorates
Solution Approach 1:
The patent creates an asymmetric thermal management structure where the resin part provides direct thermal pathways from the semiconductor modules to the heat dissipation structures. The bus bars are strategically positioned and shaped to optimize heat conduction away from the modules, breaking the symmetric mounting approach of traditional PCBs and enabling superior heat dissipation.
Solution Approach 2:
The resin part acts as an intermediary material that simultaneously provides mechanical support, electrical insulation, and thermal management. It mediates between the semiconductor modules and the external environment, conducting heat away from the modules while maintaining their electrical connections through the embedded bus bars, thus improving heat dissipation without increasing structural complexity.
3Strength
If bus bars are made rigid for structural stability, then mechanical strength is improved, but flexibility for positioning deteriorates
Solution Approach 1:
The patent applies dynamics by making the bus bars flexible rather than rigid, allowing them to be bent and shaped during assembly to achieve optimal positioning. The flexible bus bars maintain sufficient mechanical strength through their material properties and cross-sectional design, enabling both adaptability for precise positioning and structural integrity for reliable electrical connections.
Solution Approach 2:
The patent changes the physical parameters of the bus bars, specifically their flexibility and cross-sectional dimensions, to optimize both strength and adaptability. By adjusting these parameters, the bus bars achieve the right balance between mechanical strength for structural stability and flexibility for easy positioning and adaptation to different layout requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the physical size of the motor device, enhances heat dissipation, and simplifies the manufacturing process by eliminating the need for a printed circuit board, while maintaining efficient electrical connectivity and current handling capabilities.
Implementation Method 1
a resin part that encapsulates the semiconductor chip and embeds the land
Implementation Method 2
The linking member is embedded in the resin part to link the plurality of semiconductor modules
Implementation Method 3
a heat dissipation structure that dissipates heat away from the plurality of semiconductor modules
Data Source
AI summary
A linked semiconductor module unit links a plurality of semiconductor modules by a first bus bar and a second bus bar, which are embedded in resin parts. The linked semiconductor module unit is disposed in a place other than on a printed circuit board. The semiconductor module linking structure is implemented readily by molding the bus bars together with semiconductor chips and lands to form the resin parts.