Linked Vacuum Transfer Chamber for Semiconductor Substrate Transport

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Solution Overview

Problem

In semiconductor device manufacturing, substrates are often exposed to undesirable environments and contaminants during transportation between processing locations, as they are typically moved in non-vacuum conditions, which can lead to oxidation and contamination.

Innovation Solution

A linked processing tool system is introduced, comprising multiple processing tools with transfer chambers configured to maintain vacuum conditions throughout substrate transfer, using a buffer chamber to isolate and transfer substrates between processing tools while under vacuum, thereby minimizing exposure to contaminants.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If substrates are transported in non-vacuum conditions between processing locations, then substrate transport is simplified and faster, but substrates are exposed to contaminants and oxidation

Engineering Contradiction:

Improvesubstrate transport efficiencyVSAvoidcontaminant exposure

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies vacuum environment as an inert atmosphere to protect substrates during transport. Multiple transfer chambers are maintained at vacuum conditions, creating a contaminant-free environment that prevents oxidation and contamination while substrates are moved between processing tools, thus resolving the contradiction between transport efficiency and contaminant exposure.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Solution Approach 2:

The patent introduces transfer chambers as intermediary components between processing tools. These transfer chambers serve as vacuum-maintained intermediate spaces that enable substrate transport without direct exposure to atmospheric contaminants, allowing efficient transport while maintaining protective vacuum conditions throughout the transfer path.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If multiple processing tools are used to increase processing capacity, then manufacturing throughput increases, but substrate transfer complexity and contamination risk increase

Engineering Contradiction:

Improvemanufacturing throughputVSAvoidtransfer system complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent implements a universal vacuum transfer chamber design that can serve multiple processing tools. The transfer chambers are configured to interface with multiple processing tools through standardized vacuum connections, allowing a single transfer chamber to facilitate substrate movement between different tools, thereby increasing throughput while managing complexity through standardized multi-functional components.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If substrates are transferred between processing tools, then processing versatility increases, but exposure to harmful environments increases

Engineering Contradiction:

Improveprocessing versatilityVSAvoidenvironmental exposure

Core Design Contradiction:

Adaptability or versatilityVSObject-affected harmful factors

Solution Approach 1:

The patent maintains vacuum conditions throughout all transfer chambers to create a consistent inert environment that protects substrates regardless of how many tools they pass through. This allows substrates to be transferred between multiple processing tools for versatile processing sequences while continuously protecting them from atmospheric contaminants and oxidation.

Inventive Principle:

Principle #39Inert atmosphere (Inert environment)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach allows for the transportation of substrates under vacuum, significantly increasing the number of high-vacuum processing chamber locations and reducing contamination risks, while providing a unified operational experience similar to a single tool system.

Implementation Method 1

maintain a vacuum environment in a plurality of processing chambers and transfer chambers

Methodology Applied

Scientific EffectVacuum: Vacuum

Data Source

PatentUS9147592B2Linked vacuum processing tools and methods of using the same

Publication Date: 2015.09.29 APPLIED MATERIALS INC

AI summary

In some embodiments, a linked processing tool system is provided that includes (1) a first processing tool having at least a first transfer chamber configured to couple to a plurality of processing chambers; (2) a second processing tool having at least a second transfer chamber configured to couple to a plurality of processing chambers; (3) a third transfer chamber coupled between the first and second processing tools and configured to transfer substrates between the first and second processing tools; and (4) a single sequencer that controls substrate transfer operations between the first processing tool, the second processing tool and the third transfer chamber of the linked processing tool system. Numerous other aspects are provided.