Liquefied Gas Cooling for Compact Electronic Device Heat Dissipation
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Solution Overview
Problem
Portable electronic devices face challenges in heat dissipation due to their compact size, leading to overheating and potential functional failure, as conventional thermal modules may not efficiently manage heat generated by electronic components.
Innovation Solution
A method involving a cooling module that uses liquefied gas to absorb heat from a heat source within an electronic device by filling it into a chamber via an inlet valve when the temperature rises, and vaporizing and discharging the gas through an exhaust valve when the temperature or pressure reaches specific values to dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal modules with heat pipes are used, then heat can be transferred from the heat source to thermal fins, but the heat dissipation efficiency is insufficient for high-performance portable devices
Solution Approach 1:
The patent utilizes the phase transition of liquid refrigerant between liquid and vapor states within the heat source cavity. The refrigerant absorbs heat during vaporization and releases heat during condensation, creating a highly efficient passive cooling cycle that directly addresses the insufficient heat dissipation efficiency of conventional thermal modules.
Solution Approach 2:
The invention extracts the refrigerant filling process and phase transition mechanism from conventional heat pipe structures, creating a standalone cooling system with separate filling, vaporization, and condensation stages that can be independently optimized and controlled.
2Volume of moving object
If the device size is reduced for portability, then the device becomes more compact, but heat dissipation becomes more difficult leading to overheating
Solution Approach 1:
The cooling system is nested within the electronic device structure, with the heat source cavity integrated into the device housing. The refrigerant circulation path is contained within the device volume, allowing compact integration without compromising cooling performance.
Solution Approach 2:
The phase transition mechanism provides high heat dissipation efficiency in a compact form factor, as the latent heat of vaporization and condensation enables significant heat transfer within limited space, directly addressing the heat dissipation challenge of miniaturized devices.
3Reliability
If more advanced thermal modules are used, then heat dissipation efficiency improves, but the device complexity and cost increase
Solution Approach 1:
The cooling system operates autonomously through natural convection and phase transition of the refrigerant. The system self-regulates the cooling process without requiring external control mechanisms, complex sensors, or active components, thereby maintaining simplicity while achieving advanced cooling performance.
Solution Approach 2:
The invention replaces complex mechanical cooling systems (such as fans, pumps, and heat pipes) with a passive phase transition-based cooling mechanism, reducing mechanical complexity while maintaining or improving cooling efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces the temperature of electronic components by utilizing the latent heat of vaporization of the liquefied gas, providing efficient and rapid heat dissipation, thereby preventing overheating and extending the operational lifespan of portable devices.
Implementation Method 1
the temperature of the heat source is detected, and the liquefied gas is filled into the chamber via an inlet valve to absorb heat generated by the heat source when the temperature of the heat source rises to a first value
Implementation Method 2
the liquefied gas in the chamber can be vaporized and discharged through the exhaust valve to an atmospheric environment
Data Source
AI summary
A method for cooling a heat source by liquefied gas is provided, wherein the heat source is cooled by filling a liquefied gas into a chamber close to the heat source, and the heat source is located in an electronic device. The temperature of the heat source is detected, and the liquefied gas is filled into the chamber via an inlet valve to absorb heat generated by the heat source when the temperature of the heat source rises to a first value. Specifically, an exhaust valve that communicates with the chamber is opened when the temperature of the heat source decreases and then rises to a second value or the pressure inside the chamber reaches a critical value, so that the liquefied gas in the chamber can be vaporized and discharged through the exhaust valve to an atmospheric environment.