Integrated Liquid-Air Cooling Module for High-Performance Processors
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Solution Overview
Problem
Conventional cooling methods, such as fan-mounted heat sinks and heat pipes, are inadequate for modern high-performance processors and multi-chip systems due to insufficient heat dissipation and limited cooling distance, leading to sub-optimal system reliability and increased complexity.
Innovation Solution
An integrated cooling system combining liquid and air cooling structures, where a fluid path with a microchannel and double-counter flow structure is stacked with an air-cooled heat exchanger, utilizing a pump and programmable controller to optimize heat transfer and airflow, with thermal conductivity materials and strategically placed air fins to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If traditional cooling structures like fan-mounted heat sinks are used, then the system is simple to manufacture, but they cannot dissipate sufficient heat for modern high-performance processors
Solution Approach 1:
The cooling system is divided into multiple independent cooling structures, each optimized for specific heat dissipation requirements. Multiple heat sinks with different configurations are used to handle heat from different components, allowing each segment to be optimized independently while collectively providing sufficient total heat dissipation capacity
Solution Approach 2:
Multiple cooling structures are stacked vertically in a nested arrangement, with each cooling structure positioned at different heights. This allows the cooling system to maximize heat dissipation surface area within the limited vertical space, enabling sufficient heat dissipation without proportionally increasing the horizontal footprint
2Length of stationary object
If heat pipes are used for cooling, then heat can be moved from the heat source, but they are limited in both the amount of heat they can dissipate and the distance they can move heat
Solution Approach 1:
The heat transfer function is segmented between multiple components: heat pipes handle localized heat transfer from heat sources to heat sinks, while multiple stacked heat sinks provide additional heat dissipation capacity. This segmentation allows the system to overcome the distance and heat load limitations of individual heat pipes by distributing the heat transfer task across multiple pathways
3Power
If system-level cooling solutions are optimized for one system, then cooling efficiency is improved for that specific system, but the solution becomes sub-optimal for other systems and increases device complexity
Solution Approach 1:
The cooling structures are designed with universal mounting interfaces and standardized configurations that can be adapted to different system layouts and heat source positions. The stacked heat sink design provides a modular approach that can be configured for various thermal requirements while maintaining a consistent base architecture, enabling the same cooling technology to serve multiple system types
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves system reliability and cooling efficiency for multi-chip systems by maximizing heat transfer over a larger area and optimizing fluid flow and airflow, effectively addressing the limitations of traditional cooling methods.
Implementation Method 1
The first cooling structure is for circulating a first cooling medium... The fluid path contains a microchannel structure... the first cooling medium is water
Implementation Method 2
The first cooling structure is for circulating a first cooling medium... a pump coupled to the fluid path... forms a closed path for circulating a fluid
Implementation Method 3
The second cooling structure is for circulating a second cooling medium... the second cooling medium is air... a plurality of air fins
Data Source
AI summary
An integrated cooling system includes a first layer having a contact area configured for coupling to a heat source, wherein the first layer has a fluid path passes adjacent to the contact area where the heat source is in thermal contact with first layer. Coupled to the first layer is a second layer to which a number of air fins are attached. A pump is connected to the fluid path forming a closed path for circulating a fluid through the first layer. Within the first layer, the fluid path will contain a plurality of fluid fins which control the flow of a fluid within the fluid path. Within the fluid path, a structure providing a double-counter flow adjacent to one or more electronic devices. Additionally the fluid path can include a microchannel plate structure. The system can include a programmable controller connect the an air-mover, pump and temperature sensing device.