Liquid-Cooled Chip Channels That Eliminate Interface Thermal Resistance
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Solution Overview
Problem
The inefficiency of heat exchange between electronic chips and heat-transfer fluids due to the thermal resistance of interface layers in high-performance computing systems, which degrades the cooling efficiency of chips.
Innovation Solution
An electronic chip design featuring recesses on its surface for liquid circulation, with a cover providing a space for distributing the liquid and ports for injection and discharge, surrounded by an organic material block, which reduces thermal resistance and enhances heat exchange.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink separated by an interface layer is used to cool the chip, then the chip can be cooled, but the thermal resistance of the interface layer degrades the cooling efficiency
Solution Approach 1:
The patent removes the interface layer that causes thermal resistance by integrating liquid circulation channels directly into the chip substrate. The channels are etched vertically through the substrate, allowing cooling liquid to contact the active components directly without passing through an interface layer, thereby eliminating the thermal resistance barrier while maintaining cooling function.
Solution Approach 2:
The patent transitions from a planar heat sink interface to a three-dimensional vertical channel structure. By etching channels perpendicular to the substrate surface, the cooling liquid gains direct access to active components through the vertical dimension, bypassing the thermal resistance of horizontal interface layers and enabling more efficient heat extraction.
2Temperature
If the chip is cooled by a heat sink with interface layer, then cooling is provided, but the exchange surface area between chip and cooling fluid is limited
Solution Approach 1:
The patent creates vertical channels extending through the substrate thickness, adding a vertical dimension to the heat exchange surface. This three-dimensional channel structure provides significantly more surface area for heat transfer compared to a planar heat sink interface, as the cooling liquid flows through the volume rather than just across the surface.
Solution Approach 2:
The cooling channels are nested within the chip substrate itself, with channels etched through different layers including the active component layer. This nested structure allows the cooling fluid to flow through the interior of the chip, maximizing the contact surface area between the cooling fluid and heat-generating components without increasing the chip's external footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves the cooling efficiency of electronic chips by directly contacting the heat-transfer liquid, increasing the exchange surface area and reducing thermal resistance, thereby enhancing the cooling performance.
Implementation Method 1
at least one first channel for the circulation of a liquid intended to cool the chip
Implementation Method 2
circulation of a liquid intended to cool the chip
Data Source
AI summary
The present description concerns an electronic chip (202) formed on top and inside of a semiconductor substrate including, one the side of a first surface (202B), at least one active component and, on the side of a second surface (202T) opposite to the first surface, at least one channel for the circulation of a liquid intended to cool the chip.